High-Frequency Module Shield Layout for Two-Uplink Isolation
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Solution Overview
Problem
The existing high-frequency front-end modules experience insufficient isolation between transmission paths during two-uplink operations due to interference between circuit components on the module substrate.
Innovation Solution
A high-frequency module design that includes a module substrate with a ground metal member, power amplifiers, and transmission filters, where the ground metal member is strategically arranged between transmission components to enhance electromagnetic field shielding and reduce interference between transmission paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circuit components are mounted on a module substrate to reduce the number of filters and enable two-uplink two-downlink operation, then device complexity is reduced and functionality is improved, but isolation between transmission paths deteriorates due to interference between transmission components
Solution Approach 1:
A ground metal member is introduced as an intermediary element between the first and second transmission components on the module substrate. This ground metal member acts as a shield that blocks electromagnetic interference between the transmission paths, thereby maintaining isolation while enabling two-uplink two-downlink operation with reduced filter complexity
2Area of stationary object
If transmission components are arranged closely on the module substrate to reduce size, then area is reduced, but harmful electromagnetic interference between transmission paths increases
Solution Approach 1:
The ground metal member serves as a shielding intermediary that can be integrated into the compact module substrate layout. It blocks electromagnetic fields between closely spaced transmission components, allowing miniaturization without sacrificing isolation performance
3Device complexity
If the number of filters is reduced to simplify the circuit, then device complexity is reduced, but isolation between transmission paths during two-uplink deteriorates
Solution Approach 1:
The ground metal member provides physical and electromagnetic separation between transmission paths, replacing the need for additional filters. This intermediary shield maintains isolation performance while allowing circuit simplification through reduced filter count
Solution Approach 2:
Instead of adding more filters in the signal path dimension, the solution introduces a ground metal member in the spatial dimension between transmission components. This vertical/shielding dimension approach provides isolation without increasing circuit complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves the isolation between transmission paths during two-uplink operations, suppressing mutual interference and enabling efficient simultaneous transmission in different frequency bands.
Implementation Method 1
the first ground metal member is arranged between a first transmission component arranged on the first principal surface and a second transmission component arranged on the first principal surface
Data Source
AI summary
A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.