RF Module Shield Wall Layout for Lower Component Noise Coupling
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Solution Overview
Problem
Conventional radio frequency modules do not sufficiently reduce noise interference between components.
Innovation Solution
A radio frequency module design featuring a module substrate with metal walls and via conductors set to ground potential, overlapping and connecting metal layers to reduce electromagnetic field coupling between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield wall is disposed between two adjacent components, then noise interference between components is suppressed, but the noise interference is not sufficiently reduced in some cases
Solution Approach 1:
The shield wall is divided into multiple sections along the direction extending from the first principal surface to the second principal surface. These segmented shield wall sections are electrically connected to each other and to the first via conductor, creating multiple shielding zones that more effectively block electromagnetic interference while maintaining signal quality.
Solution Approach 2:
The shield wall extends in multiple dimensions - from the first principal surface to the second principal surface, and is divided into sections along this direction. This three-dimensional shielding structure provides more comprehensive noise suppression compared to conventional two-dimensional shield walls.
2Object-affected harmful factors
If conventional shield wall structure is used, then manufacturing is simplified, but noise interference reduction effect is insufficient
Solution Approach 1:
The shield wall is segmented into multiple sections that are electrically connected, creating a more complex but effective shielding structure. The segmentation allows for better noise interference reduction while maintaining manageable manufacturing processes through standardized connection methods.
Solution Approach 2:
The segmented shield wall sections are nested along the direction from the first principal surface to the second principal surface, with each section electrically connected to the next. This nested configuration enhances shielding effectiveness while organizing the complexity in a structured manner.
3Object-affected harmful factors
If metal layer and metal wall are arranged without overlap, then manufacturing is easier, but noise interference reduction is insufficient
Solution Approach 1:
The metal layer and metal wall are arranged to overlap when viewed in plan, utilizing the horizontal dimension for enhanced shielding. This overlapping arrangement in the plan view, while maintaining vertical separation, provides superior noise interference reduction without requiring extreme manufacturing precision.
Solution Approach 2:
The overlapping arrangement of the metal layer and metal wall is implemented specifically in regions where noise interference is most critical. This localized quality enhancement provides targeted noise suppression while maintaining overall manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the effect of reducing noise interference, improving signal quality and reception sensitivity.
Implementation Method 1
a first via conductor penetrating the module substrate, in which the first metal wall is disposed between the first component and the second component when the first principal surface is viewed in plan, an upper end of the first metal wall is in contact with the metal layer, and the first via conductor electrically connects the first metal wall and the first metal member
Implementation Method 2
at least partially overlaps each of the first metal wall and the first metal member when viewed in plan... capable of enhancing an effect of reducing the noise interference
Data Source
AI summary
A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a metal member disposed on the second principal surface, and a via conductor penetrating the module substrate. The metal shield wall is disposed between the first component and the second component when the first principal surface is viewed in plan. An upper end of the metal shield wall is connected to the metal shield layer. The via conductor electrically connects the metal shield wall and the metal member, and at least partially overlaps each of the metal shield wall and the metal member when viewed in plan.