RF Module Shield Structure for Heat Dissipation and Laser Marking
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Solution Overview
Problem
The challenge is to enhance heat dissipation and maintain high visibility of engravings on miniaturized radio frequency modules, while ensuring effective electrical characteristics and preventing damage from laser processing.
Innovation Solution
The radio frequency module design includes a module substrate with a first circuit component, a resin member covering the side surface of the component, a metal layer in contact with the top surfaces of the resin member and the first circuit component, and an engraved portion on the resin member's top surface, positioned not to overlap the first circuit component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the radio frequency module is miniaturized, then the size is reduced, but the visibility of the engraving becomes poor
Solution Approach 1:
The patent applies color contrast by providing the resin member in a first color (e.g., black) and the metal layer in a second color (e.g., silver or white). The engraved portion reveals the metal layer underneath, creating a high-contrast visual difference that maintains engraving visibility even as the module size decreases. This color differentiation allows the engraving to remain clearly visible without increasing the overall module dimensions.
2Temperature
If heat dissipation is improved by adding metal layers, then thermal performance increases, but device complexity increases
Solution Approach 1:
The metal layer serves multiple functions simultaneously: it acts as a heat dissipation path for thermal management, provides a reflective surface for the engraved portion to enhance visibility, and can serve as an electromagnetic shielding layer. By integrating these multiple functions into a single structural element, the patent improves heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The patent combines the heat dissipation function and the visual identification function into a single integrated structure. The metal layer is positioned to both conduct heat away from the circuit component and be exposed at the engraved portion for visibility. This merging of functions reduces the need for separate components and simplifies the overall device structure.
3Measurement precision
If laser processing is used to create engravings, then marking precision is improved, but circuit components may be damaged
Solution Approach 1:
The resin member acts as an intermediary protective layer between the laser processing beam and the underlying circuit component. The laser is used to engrave the resin member to create the visible marking, and since the resin member is positioned above the circuit component, the laser energy is absorbed by the resin rather than reaching and damaging the sensitive circuit elements below. This intermediary structure enables precise laser engraving while protecting the circuit component integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves excellent heat dissipation by allowing heat from the first circuit component to be efficiently transmitted to the metal layer, while maintaining high visibility of the engraving and preventing damage to the circuit components from laser processing.
Implementation Method 1
heat generated in the electronic component is dissipated through the metal film
Data Source
AI summary
A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.