RF Module Shielding and Thermal Management via Nested Metal Block
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Solution Overview
Problem
Existing radio-frequency modules lack effective shielding, which can lead to increased temperatures and degradation of filter characteristics, affecting the stability and performance of communication devices.
Innovation Solution
A radio-frequency module design incorporating a mount board with a ground layer, an acoustic wave filter, a metal block connected to the ground layer, a resin layer covering the filter and metal block, and a shield layer that contacts the metal block and filter, enhancing shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a radio-frequency module operates without effective shielding, then the device complexity is reduced, but the temperature increases and filter characteristics degrade
Solution Approach 1:
The patent implements a nested shielding structure where an inner shield electrode is positioned within the acoustic wave filter assembly, and an outer shield electrode surrounds it. The inner shield is nested between the acoustic wave filter substrate and the mount board, while the outer shield is formed on the mount board, creating a multi-layer nested shielding configuration that effectively contains RF energy and dissipates heat without excessive complexity
Solution Approach 2:
The patent introduces a resin layer as an intermediary substance that fills the space between the inner shield electrode and the acoustic wave filter, and between the outer shield electrode and the metal block. This resin layer acts as a mediator that provides electrical insulation, mechanical support, and thermal management, enabling the shielding structure to function effectively while maintaining device integrity
2Object-affected harmful factors
If shielding structures are added to the radio-frequency module, then shielding performance is improved, but the device complexity increases
Solution Approach 1:
The patent merges the shielding function with existing structural components of the radio-frequency module. The outer shield electrode is integrated into the mount board structure, and the inner shield electrode is incorporated within the acoustic wave filter assembly. This merging approach allows the shielding function to be achieved without adding separate, independent shielding components, thereby improving shielding performance while minimizing increases in device complexity
Solution Approach 2:
The shielding electrodes serve multiple functions simultaneously: they provide RF shielding to contain electromagnetic energy, act as heat sinks to dissipate thermal energy from the acoustic wave filter, and provide structural support when combined with the resin layer. This multi-functionality reduces the need for separate components, improving shielding performance without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved shielding and heat dissipation, stabilizing the acoustic wave filter and maintaining the performance of the radio-frequency module, thereby preventing temperature increases and filter degradation.
Implementation Method 1
The metal block is disposed on the first principal surface of the mount board, and is connected to the ground layer... The metal block is in contact with the shield layer
Implementation Method 2
The shield layer covers a principal surface, which is on the opposite side to the mount board side, of the acoustic wave filter, the resin layer, and the metal block
Data Source
AI summary
A radio-frequency module includes a mount board, an acoustic wave filter, a metal block, a resin layer, and a shield layer. The mount board has a first principal surface and a second principal surface opposite to each other, and has a ground layer. The acoustic wave filter is mounted on the first principal surface of the mount board. The metal block is disposed on the first principal surface of the mount board, and is connected to the ground layer. The resin layer is disposed on the first principal surface of the mount board, and covers the periphery of the acoustic wave filter and the periphery of the metal block. The shield layer covers the principal surface, which is on the opposite side to the mount board side, of the acoustic wave filter, the resin layer, and the metal block. The metal block is in contact with the shield layer.