RF Module Shield-Metal Layout for Power Amplifier Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radio-frequency modules face insufficient heat dissipation issues due to increased output power in advanced power classes, leading to potential thermal management challenges in mobile communication systems.
Innovation Solution
A radio-frequency module design that includes a module substrate with a shield layer and a metal member positioned between the integrated circuit's surface and the shield layer, where the metal member overlaps via conductors and the shield layer, enhancing heat dissipation by shortening the thermal path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If output power is increased in advanced power classes, then communication performance is improved, but heat generation of the power amplifier increases
Solution Approach 1:
The patent introduces a vertical heat dissipation path by placing a heat dissipation structure on the upper surface of the module substrate, perpendicular to the conventional horizontal heat dissipation plane. This three-dimensional heat dissipation architecture allows heat to escape in multiple directions, effectively managing thermal load from high-power amplifiers without limiting output power increase.
2Temperature
If heat dissipation structure is added on the upper surface, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The module substrate serves multiple functions: it provides mechanical support for mounting components, establishes electrical connections through conductive patterns, and acts as a heat dissipation pathway. The upper surface structure simultaneously provides shielding and heat dissipation, reducing the need for separate dedicated heat sinks and simplifying the overall device architecture.
Solution Approach 2:
The patent combines the heat dissipation function with the existing module substrate and shielding structures. The heat dissipation structure is integrated into the substrate's upper surface, merging thermal management with the structural and electromagnetic shielding functions already present in the design, thereby avoiding additional complexity.
3Temperature
If metal member overlaps via conductor and shield layer, then thermal resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The heat dissipation structure is divided into multiple segments or zones with different metal layers (first metal layer, second metal layer) positioned at different heights and locations. This segmentation allows each layer to be optimized for specific thermal pathways and makes the alignment process more manageable by breaking down the complex overlapping requirement into simpler, staged manufacturing steps.
Solution Approach 2:
The via conductors act as intermediary elements that connect the lower heat-generating components to the upper heat dissipation structure. These via conductors serve as alignment references and thermal conduits, mediating the thermal transfer between different layers and providing fixed reference points that simplify the positioning of overlapping metal members during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation from the power amplifier, reducing thermal resistance and enhancing the module's thermal management capabilities, thereby addressing the insufficiencies in existing designs.
Implementation Method 1
at least one via conductor connecting the first transistor to the first metal member
Implementation Method 2
a first metal member that is arranged between the fourth main surface of the first integrated circuit and the shield layer
Data Source
AI summary
A radio-frequency module includes: a module substrate; multiple external connection terminals that are arranged on a main surface of the module substrate; an integrated circuit that is arranged on a main surface of the module substrate; a shield layer that is arranged above the main surface of the integrated circuit; and a metal member that is arranged between the main surface of the integrated circuit and the shield layer. The integrated circuit includes transistors arranged on the main surface and constituting a power amplifier and via conductors connecting the transistors to the metal member. The metal member at least partially overlaps the via conductors and at least partially overlaps the shield layer in a plan view of the module substrate.