RF Module Shield Wall Noise Isolation
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Solution Overview
Problem
Conventional radio frequency module designs fail to sufficiently reduce noise entry into radio frequency signals, which affects the performance of communication devices.
Innovation Solution
A radio frequency module with a module substrate having electronic components on both surfaces, external-connection terminals, and metal walls at ground potential, where the metal walls surround and separate the external-connection terminals to inhibit noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional radio frequency module designs are used, then the module structure is simpler, but noise entry into radio frequency signals is not sufficiently reduced
Solution Approach 1:
The module substrate is divided into distinct regions: a first region containing the radio frequency processing unit and a second region containing the system unit and power supply circuit unit. A shield wall is introduced as a separate partition structure between these regions, segmenting the electromagnetic environment to prevent noise propagation from the power supply and system units to the radio frequency processing unit.
Solution Approach 2:
A shield wall made of conductive material is introduced as an intermediary structure between the power supply circuit unit and the radio frequency processing unit. This shield wall acts as a mediator that blocks electromagnetic noise from the power supply unit while allowing the module to maintain its integrated structure. The shield wall is connected to ground potential to effectively divert noise away from sensitive radio frequency signals.
2Object-affected harmful factors
If shield wall is introduced to reduce noise, then noise entry into radio frequency processing unit is reduced, but module size increases
Solution Approach 1:
The shield wall is positioned in the vertical dimension (thickness direction of the module substrate) rather than expanding the horizontal footprint. By utilizing the third dimension (depth/thickness) to place the shield wall between the upper and lower surfaces of the module substrate, the solution achieves effective noise shielding without increasing the planar area of the module, thus maintaining compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise entry into radio frequency signals, improving the electrical characteristics and noise figure of the module, while also downsizing the module and simplifying manufacturing.
Implementation Method 1
a first metal wall disposed on the second principal surface and set at a ground potential... at least part of the first metal wall is disposed between the first external-connection terminal and the second external-connection terminal
Data Source
AI summary
A radio frequency module includes: a module substrate including a first principal surface and a second principal surface opposite to each other; a first electronic component (e.g., power amplifier) disposed on the first principal surface; a second electronic component (e.g., low-noise amplifier) disposed on the second principal surface; post electrodes disposed on the second principal surface; and a plated shield wall disposed on the second principal surface and set at a ground potential. Here, the post electrodes include a first post electrode through which a first radio frequency signal is input or output, and a second post electrode through which a power-supply signal is input or output. In a plan view of the module substrate, the plated shield wall surrounds one of the first and second post electrodes, and at least part of the plated shield wall is disposed between the first and second post electrodes.