RF Module Shielding via Metal Thin Film Sputtering
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Solution Overview
Problem
Conventional electromagnetic shielding structures for radio frequency modules are inefficient, causing hidden damage, increasing production costs and product size due to high-temperature re-soldering and requiring additional space for metal cover bodies.
Innovation Solution
An anti-electromagnetic interference radio frequency module with a metal thin film structure integrated into the module body, connected to a grounding area via conductive materials, forming an anti-electromagnetic interference shielding layer, which is formed using a metal thin film sputtering process to reduce electromagnetic interference effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal cover body is used for electromagnetic shielding, then electromagnetic interference is isolated, but the product dimension is increased
Solution Approach 1:
The patent replaces the conventional thick metal cover body with a thin film metal layer deposited on the circuit board. This thin film structure provides effective electromagnetic shielding while occupying minimal space, thereby resolving the contradiction between interference isolation and product dimension.
Solution Approach 2:
The patent substitutes the mechanical assembly of a separate metal cover body with a deposited metal thin film structure integrated into the circuit board. This eliminates the need for additional mechanical components and assembly steps, reducing overall product dimension while maintaining shielding effectiveness.
2Object-affected harmful factors
If high-temperature re-soldering is performed to connect metal cover body, then electromagnetic shielding is achieved, but hidden damage such as short circuit may be caused
Solution Approach 1:
The patent replaces the high-temperature soldering process with a metal thin film deposition process. This eliminates the thermal stress that causes tin fluid channeling and solder mask peeling, thereby preventing short circuits and improving product reliability while achieving electromagnetic shielding.
Solution Approach 2:
The patent changes the connection method from high-temperature mechanical soldering to low-temperature physical vapor deposition. This parameter change in temperature and connection mechanism eliminates the harmful effects of high-temperature processing on the circuit board and components.
3Object-affected harmful factors
If high-temperature re-soldering step is added to connect metal cover body, then electromagnetic shielding structure is formed, but workhour and cost increase
Solution Approach 1:
The patent merges the electromagnetic shielding structure with the circuit board by depositing the metal thin film directly onto the board during the PCB manufacturing process. This integration eliminates the need for separate high-temperature re-soldering steps, reducing production time and cost while achieving effective electromagnetic shielding.
4Object-affected harmful factors
If metal cover body is assembled to achieve electromagnetic shielding, then interference isolation is improved, but the space occupied by product is increased
Solution Approach 1:
The patent uses a thin film metal layer instead of a bulky metal cover body. This thin film structure provides the necessary electromagnetic shielding function while occupying minimal volume, effectively resolving the contradiction between interference isolation and product volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates electromagnetic interference, improving the performance of radio frequency modules while simplifying and cost-effectively integrating the shielding layer into the existing production process without increasing the module's size or mass.
Implementation Method 1
a metal thin film structure attached to upper and lower surfaces and side surfaces of the radio frequency module body... forming an anti-electromagnetic interference shielding layer structure
Implementation Method 2
formed using a metal thin film sputtering process
Data Source
AI summary
An anti-electromagnetic interference radio frequency module and an implementation method therefor. The anti-electromagnetic interference radio frequency module comprises a radio frequency module body, the inside of the radio frequency module body is provided with an electrical connection area (1) and a grounding area (2), a metal thin film structure (4) is attached to an upper surface and side surfaces of the radio frequency module body, and the metal thin film structure is connected to the grounding area, forming an anti-electromagnetic interference shielding layer structure which is integrated with the radio frequency module body. The radio frequency module achieves an anti-electromagnetic interference effect by means of the anti-electromagnetic interference shielding layer structure, so that electromagnetic interference generated around the radio frequency module is effectively isolated, thereby improving the performance of the radio frequency module.