RF Module Shielding Structure With Improved Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing radio frequency modules face challenges in improving heat dissipation and shielding properties, as the heat dissipation layer made of metal does not effectively manage thermal issues and noise shielding.

Innovation Solution

A radio frequency module design incorporating a mounting board, an electronic component, a resin layer, and a metal electrode layer, where the resin layer covers the electronic component's outer peripheral surface, and the metal electrode layer covers the electronic component and resin layer, with an inclined surface connecting the main and outer peripheral surfaces, enhancing heat dissipation and shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal heat dissipation layer covers the electronic component, then shielding properties improve, but heat dissipation properties deteriorate

Engineering Contradiction:

Improveshielding propertiesVSAvoidheat dissipation properties

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent divides the covering structure into two distinct layers: a resin layer that directly contacts the electronic component for heat dissipation, and a metal electrode layer that covers the resin layer for shielding. This segmentation allows each layer to perform its specialized function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin layer serves as an intermediary between the electronic component and the metal electrode layer. It transfers heat from the component while the metal layer provides shielding, preventing direct contact between the metal and component that would hinder heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the metal electrode layer directly covers the electronic component, then shielding properties improve, but contact area for heat dissipation is reduced

Engineering Contradiction:

Improveshielding propertiesVSAvoidcontact area

Core Design Contradiction:

Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The patent segments the shielding function from the heat dissipation function by introducing a resin layer. The metal electrode layer covers the resin layer for shielding, while the resin layer maintains direct contact with the electronic component for heat dissipation, thereby preserving maximum contact area.

Inventive Principle:

Principle #1Segmentation

3Temperature

If the resin layer covers the entire electronic component, then heat dissipation improves, but shielding properties deteriorate

Engineering Contradiction:

Improveheat dissipation propertiesVSAvoidshielding properties

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent implements a two-layer structure where the resin layer covers the electronic component for heat dissipation, and the metal electrode layer covers the resin layer for shielding. This segmentation ensures both heat dissipation and shielding functions are fulfilled simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin layer serves dual purposes: it provides thermal management by contacting the electronic component and serves as a substrate for the metal electrode layer, which provides shielding. This multi-functional arrangement achieves both heat dissipation and shielding.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation and shielding properties by increasing the contact area between the metal electrode layer and the electronic component, effectively dissipating heat and suppressing noise, thereby maintaining the electronic component's performance.

Implementation Method 1

the metal electrode layer covers the main surface of the electronic component and a main surface of the resin layer... improving heat dissipation properties

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

since the heat dissipation layer is made of metal, the electronic component can be shielded from noise due to an external magnetic field or the like

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20240347905A1Radio frequency module, manufacturing method of radio frequency module, and communication device

Publication Date: 2024.10.17 MURATA MFG CO LTD

AI summary

A radio frequency module that can improve heat dissipation properties and shielding properties is provided. In a radio frequency module, an electronic component has a main surface on an opposite side of a mounting board side and an outer peripheral surface. A resin layer covers at least a part of the outer peripheral surface of the electronic component. A metal electrode layer covers the main surface of the electronic component and a main surface of the resin layer on the opposite side of the mounting board side. In plan view from a thickness direction of a mounting board, an outer edge of the main surface of the electronic component is located on an inner side of an outer edge of the electronic component. The electronic component further has an inclined surface.