High-Frequency Module Shielding Layout for EMI and Noise Suppression
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Solution Overview
Problem
Existing high-frequency front-end circuits in mobile communication devices face issues with deterioration of electrical characteristics such as noise figure, gain characteristics, and others.
Innovation Solution
A high-frequency module is designed with a first substrate having module components, a resin member to cover the substrate, and a metal shield layer set to ground potential, enhancing electrical characteristics by suppressing noise and electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit components are packaged in a front-end circuit to support multi-band mobile communication, then the adaptability and functionality are improved, but the electrical characteristics such as noise figure and gain characteristics deteriorate due to increased electromagnetic interference and noise
Solution Approach 1:
The front-end circuit is divided into separate packaged components (power amplifier, low-noise amplifier, switch circuit, duplexer) rather than integrating them in a single package. This segmentation reduces electromagnetic interference between components while maintaining multi-band functionality through selective assembly and connection of individual components.
2Device complexity
If circuit components are integrated in a compact front-end circuit, then the device complexity is reduced, but the electrical characteristics deteriorate due to closer proximity of components causing increased interference
Solution Approach 1:
The patent transitions from planar arrangement of components to a three-dimensional stacked configuration where components are arranged vertically across multiple layers. This dimensional change allows compact integration while maintaining electrical isolation through intermediate substrates and grounding structures, thus preserving electrical characteristics despite reduced device footprint.
3Adaptability or versatility
If more circuit components are disposed on the substrate to support multiple bands, then the adaptability is improved, but the noise and electromagnetic coupling increase leading to deterioration of electrical characteristics
Solution Approach 1:
Grounding structures and shielding layers are introduced as intermediary elements between active circuit components. These intermediaries provide electromagnetic isolation and noise suppression, allowing multiple components to coexist on the substrate without significant interference, thus enabling multi-band support while maintaining electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves electrical characteristics by reducing noise and electromagnetic interference, leading to enhanced performance and reliability of high-frequency modules in communication devices.
Implementation Method 1
a first metal shield layer configured to cover a top surface of each of the first resin member and the one or more module components, and to be set to ground potential
Implementation Method 2
a second metal shield layer covering a side surface of each of the second resin member and the second substrate, and set to the ground potential
Data Source
AI summary
A high-frequency module includes a module substrate having main surfaces, one or more module components disposed on the main surface, a resin member covering the main surface, and a metal shield layer covering a top surface of each of the resin member and the one or more module components, and set to ground potential. A sub-module component, which is one of the one or more module components, has a sub-module substrate having main surfaces, a first circuit component disposed on the main surface, one or more second circuit components disposed on the main surface, a resin member covering the main surface, and a side surface shield layer covering a side surface of each of the resin member and the sub-module substrate, and set to the ground potential. An end surface on a top surface side of the side surface shield layer contacts the metal shield layer.