RF Module Shielding via Nested Grounded Metal Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules with double-sided mounting substrates fail to provide a sufficient shielding effect for radio frequency components, which is crucial for reducing the size of radio frequency modules in multiband communications.
Innovation Solution
A radio frequency module design that includes a module substrate with a metal member set at ground potential, covering the semiconductor component, which enhances the shielding effect by reducing exogenous noise and improving electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a double-sided mounting substrate is used to reduce module size, then the volume of the radio frequency module is reduced, but the shielding effect for radio frequency components becomes insufficient
Solution Approach 1:
The patent implements a nested shielding structure where an first shielding member is disposed within the semiconductor component and an second shielding member is disposed over the semiconductor component. This nested arrangement provides comprehensive shielding coverage within the compact module volume, addressing the insufficient shielding effect while maintaining the reduced module size enabled by the double-sided mounting substrate.
Solution Approach 2:
The patent extends the shielding approach from a single-plane configuration to a three-dimensional nested structure. The first shielding member is positioned at the bottom of the semiconductor component while the second shielding member is positioned at the top, creating vertical shielding layers that provide comprehensive electromagnetic shielding throughout the component's volume, thereby improving shielding effectiveness without increasing the module's footprint area.
2Adaptability or versatility
If the number of circuit elements is increased for multiband communications, then the communication functionality is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple shielding functions into a unified nested shielding structure integrated with the semiconductor component. The first and second shielding members work together as a coordinated system to provide comprehensive electromagnetic shielding for all circuit elements, simplifying the overall design while supporting multiband communication functionality across multiple frequency ranges.
Solution Approach 2:
The nested shielding structure serves multiple functions simultaneously: it provides electromagnetic shielding for radio frequency components, acts as a structural framework for mounting various circuit elements, and enables thermal management pathways. This multi-functional design supports complex multiband communication capabilities without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively improves the shielding effect for radio frequency components, enhancing the noise figure and receiving sensitivity of the module, while allowing for downsizing and increased isolation between different amplifier components.
Implementation Method 1
a metal member set at a ground potential and covering at least part of a surface of the semiconductor component, the surface being opposite to a surface that faces the module substrate
Data Source
AI summary
A radio frequency module includes: a module substrate including a first principal surface and a second principal surface opposite to each other; a plurality of external-connection terminals (e.g., a plurality of post electrodes) disposed on the second principal surface; a semiconductor component disposed on the second principal surface and including a first low-noise amplifier and/or a second low-noise amplifier; and a metal member set at a ground potential and covering at least part of a surface of the semiconductor component, the surface being opposite to a surface that faces the module substrate.