Radio-Frequency Module Shielding for Bottom Surface Noise
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Solution Overview
Problem
Existing radio-frequency modules do not provide sufficient shielding for components mounted on the bottom surface of a circuit board, leading to inadequate protection against noise interference.
Innovation Solution
A radio-frequency module design that includes a circuit board with components mounted on both surfaces, sealed by resin layers, and a shield configuration using a shield electrode, shield member, and shield film to cover and connect the components, ensuring comprehensive shielding by overlapping the shield electrode with components on the bottom surface and using the shield member to prevent mutual noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are mounted on both surfaces of the circuit board to achieve high-density packaging, then the packaging density is improved, but the shielding performance for components on the bottom surface deteriorates
Solution Approach 1:
The shielding structure is segmented into multiple functional parts: a shield film covering the top surface sealing resin, a shield electrode covering the bottom surface sealing resin, and shield members disposed within the bottom sealing resin between components. This segmentation allows each part to address specific shielding needs, enabling effective shielding for bottom surface components while maintaining high-density packaging
Solution Approach 2:
The shielding approach transitions from a single-surface coverage method to a multi-dimensional shielding system. The shield film covers the top surface, while the shield electrode and shield members provide shielding from the bottom surface and internal dimensions, creating comprehensive three-dimensional shielding coverage that protects components on both surfaces
2Device complexity
If a shield film is applied only to the top surface sealing resin, then the manufacturing complexity is reduced, but the shielding performance for bottom surface components deteriorates
Solution Approach 1:
The shielding function is segmented across multiple elements: the shield film for top surface coverage, the shield electrode for bottom surface coverage, and shield members for internal component protection. This segmentation distributes the shielding function across simple, manufacturable components while achieving comprehensive shielding performance
Solution Approach 2:
The shield electrode serves multiple functions: it covers the bottom surface sealing resin similar to how the shield film covers the top surface, and simultaneously provides a mounting base for the shield members. This multi-functionality reduces the need for additional separate structures, maintaining manufacturing simplicity while enhancing shielding capability
Data Source
AI summary
A radio-frequency module includes a multilayer circuit board, components mounted on a top surface of the multilayer circuit board, a first sealing resin layer sealing the components, a plurality of components mounted on a bottom surface of the multilayer circuit board, a second sealing resin layer sealing the components, a shield electrode disposed on a bottom surface of the second sealing resin layer in a region that overlaps a predetermined component, a shield wall disposed between the predetermined component and another component, part of the shield wall being exposed from the bottom surface of the second sealing resin layer and connected to the shield electrode, and a shield film covering a top surface and side surface of the first sealing resin layer and a side surface of the multilayer circuit board.