RF Module Terminal Layout for High Signal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In multiband communication devices, achieving high isolation between input and output terminals is challenging due to increasing mounting density of circuit elements and complex wiring patterns, which can lead to deterioration of signal isolation as devices shrink in size and grow in performance.
Innovation Solution
A radio-frequency module design featuring a single semiconductor chip with integrated switches and filters on a multilayer substrate, where terminal distances are strategically arranged to minimize overlap and maximize separation, utilizing band pass filters and matching circuits to enhance isolation between signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the mounting density of circuit elements is increased to reduce device size, then the device size is reduced, but the isolation between input and output terminals deteriorates
Solution Approach 1:
The patent transitions from planar 2D layout to 3D立体 arrangement by utilizing multiple layers of substrate. The first and second switches are positioned on different layers with the first filter on an intermediate layer, creating vertical separation that maintains isolation while reducing footprint area.
Solution Approach 2:
The patent implements a nested hierarchical structure where the first filter is positioned between the first and second switches in both physical space and signal flow. The first filter connects to terminals on different layers, creating a nested arrangement that integrates filtering function within the compact multi-layer structure.
2Adaptability or versatility
If more circuit elements are mounted to increase device performance, then the device performance is improved, but the isolation between input and output terminals deteriorates
Solution Approach 1:
The patent divides the signal path into distinct segments separated by the first filter. The filter acts as an independent functional block between the first switch (input side) and second switch (output side), segmenting the circuit to prevent signal interference while maintaining multiple functional elements.
Solution Approach 2:
The first filter serves as an intermediary element positioned between the first and second switches. It mediates the signal transmission by providing frequency-selective coupling, allowing desired signals to pass while blocking interfering signals, thus maintaining isolation despite the presence of multiple circuit elements.
3Adaptability or versatility
If complex wiring patterns are used to accommodate more functions, then the device functionality is enhanced, but the isolation between input and output terminals deteriorates
Solution Approach 1:
The patent resolves wiring complexity by utilizing the vertical dimension through multiple substrate layers. Instead of complex planar routing, connections are established through vertical vias and stacked arrangements, simplifying the wiring pattern while maintaining isolation through layer separation.
Data Source
AI summary
A radio-frequency module includes a first terminal, a second terminal, a first switch including a first switch terminal connected to the first terminal and a second switch terminal connectable to the first switch terminal, a second switch including a third switch terminal connectable to the second terminal, a first filter connected between the second switch terminal and the third switch terminal, and a substrate. The first switch and the second switch are included in a single semiconductor chip. The first filter and the semiconductor chip are on the substrate. In a plan view of the substrate, a first distance between the third switch terminal and the first switch terminal or a second distance between the third switch terminal and the second switch terminal is greater than a third distance between the first switch terminal and the second switch terminal.