Multiband RF Module Board Layout for Size and Signal Isolation

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Solution Overview

Problem

The existing radio frequency modules face challenges in size reduction due to the need for multiple power amplifiers to support multiband technology, leading to increased module size and potential interference that degrades the quality of radio frequency signals.

Innovation Solution

A radio frequency module design with power amplifiers for different frequency bands on opposite sides of a module board, utilizing a switch to connect output terminals and minimize signal leakage, along with optimized placement of circuit elements to reduce size and improve signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple power amplifiers are added to support multiband technology, then the frequency band coverage is improved, but the module size increases

Engineering Contradiction:

Improvefrequency band coverageVSAvoidmodule size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Multiple power amplifiers handling different frequency bands are mounted on the same first principal surface of the module board, merging their spatial occupation into a single plane rather than distributing them across multiple surfaces or volumes, thereby reducing overall module size while maintaining multiband capability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the third dimension by mounting components on opposite surfaces of the module board (first principal surface for power amplifiers, second principal surface for switches), effectively using vertical stacking to reduce the horizontal footprint and overall module area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If multiple power amplifiers are placed close together, then the module size is reduced, but signal interference increases and degrades signal quality

Engineering Contradiction:

Improvemodule sizeVSAvoidsignal interference

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The module board is divided into distinct functional zones: power amplifiers are segregated on the first principal surface while switches are placed on the second principal surface, creating spatial segmentation that reduces electromagnetic interference between these high-power components

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The module board itself acts as an intermediary barrier between power amplifiers and switches, with the board's substrate providing electromagnetic shielding and isolation, thereby reducing signal leakage and interference while allowing compact component placement

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11394406B2Radio frequency module and communication device

Publication Date: 2022.07.19 MURATA MFG CO LTD

AI summary

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a first frequency band; a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch disposed on the second principal surface and connected to an output terminal of the first power amplifier and an output terminal of the second power amplifier.