RF Module Stacked Circuit Via Electrode Wiring Loss
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Solution Overview
Problem
The radio frequency module disclosed in existing technologies experiences significant mismatching loss due to long wiring between stacked integrated circuits and acoustic wave filters, leading to increased wiring loss and variation, which affects electrical characteristics.
Innovation Solution
The proposed radio frequency module design includes a substrate with circuit components where one component is a switch connected between an antenna connection terminal and a filter, and the other component is connected via a via electrode or side wiring, reducing wiring length and mismatching loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuits are stacked over acoustic wave filters to achieve downsizing, then the module size is reduced, but wiring length increases causing higher mismatching loss
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by utilizing via electrodes that extend vertically through substrate layers. This dimensional change allows signal paths to remain short even when components are stacked, resolving the contradiction between miniaturization and wiring loss by moving the connection architecture from 2D to 3D space.
Solution Approach 2:
The patent implements a stacked configuration where circuit components are nested vertically over acoustic wave filters, with multiple substrate layers containing wiring patterns nested within each other. This nesting approach enables compact module size while maintaining short effective wiring lengths through vertical interconnections via via electrodes.
2Loss of energy
If wiring length is reduced by changing connection method, then mismatching loss decreases, but manufacturing complexity increases
Solution Approach 1:
The patent merges the wiring patterns and substrate structures across multiple layers, integrating via electrodes directly into the substrate manufacturing process. This consolidation of wiring and structural elements into a unified multi-layer construction reduces the number of separate assembly steps, making the advanced three-dimensional wiring architecture manufacturable through standard multi-layer PCB or ceramic substrate processes.
Data Source
AI summary
A radio frequency module includes: a module substrate; a first circuit component disposed on a first principal surface of the module substrate; and a second circuit component stacked on the first circuit component. Here, one of the first circuit component and the second circuit component includes a reception filter, the other of the first circuit component and the second circuit component includes a switch connected between an antenna connection terminal and the reception filter, and the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.