Stacked RF Module Architecture for Compact Transmit-Receive Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional radio frequency front-end modules are complex and lack miniaturization, which is essential for modern mobile communication devices with multiband technologies.
Innovation Solution
A radio frequency module design that stacks semiconductor devices containing power amplifiers and switches on a module board, reducing the module's area and wiring lengths to achieve miniaturization and improve electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional front-end modules use planar arrangement of circuit components, then the module area is larger, but the wiring lengths are shorter and manufacturing is easier
Solution Approach 1:
The patent transitions from a planar two-dimensional arrangement of circuit components to a three-dimensional stacked configuration. Multiple semiconductor devices (power amplifiers, switches, filters) are arranged vertically in layers on the module board, utilizing the third dimension (height/stacking direction) to reduce the horizontal footprint area while maintaining functional connectivity through vertical interconnections.
2Area of stationary object
If circuit components are arranged in a planar configuration, then manufacturing is easier, but the module cannot be miniaturized
Solution Approach 1:
The invention employs vertical stacking of semiconductor devices along the z-axis (height direction) to achieve miniaturization in the planar area. Multiple functional layers are stacked above each other on the module board, reducing the required horizontal space while maintaining manufacturability through standardized vertical stacking processes and interconnection techniques.
3Area of stationary object
If semiconductor devices are stacked vertically, then the module area is reduced, but the wiring complexity increases
Solution Approach 1:
The patent implements vertical stacking of semiconductor devices to reduce module area, accepting increased wiring complexity as a trade-off. The stacked configuration requires three-dimensional interconnection paths between devices in different layers, which can be managed through vertical vias, through-silicon vias, or other vertical interconnection technologies.
Data Source
AI summary
A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.