RF Module Layer Structure for Thermal Stress Relief
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Solution Overview
Problem
Radio-frequency modules experience characteristic degradation due to stress applied to electronic components on the mounting board, which can bend during manufacturing or usage, leading to potential bending and heat-induced issues.
Innovation Solution
A radio-frequency module configuration that includes a mounting board, electronic components, an external connection terminal, a resin layer, and an insulating layer, where the insulating layer is harder than the resin layer and disposed over the electronic components or both the resin layer and electronic components, using materials like silicon carbide, silicon dioxide, or silicon nitride to alleviate stress and facilitate heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is applied to the mounting board during manufacturing or usage, then the mounting board becomes bent, but stress is applied to the electronic component resulting in characteristic degradation
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the mounting board and the electronic component. This resin layer absorbs and distributes the stress generated by thermal expansion differences, preventing direct stress transmission to the electronic component while maintaining thermal stability.
Solution Approach 2:
The patent employs a composite structure combining the mounting board, resin layer, and electronic component with different thermal expansion coefficients. This composite design allows each layer to accommodate thermal stress independently, reducing the overall impact on component reliability during temperature variations.
2Strength
If the mounting board is made more rigid to prevent bending, then stress on electronic components increases, but manufacturing complexity increases
Solution Approach 1:
The mounting structure is segmented into distinct functional layers: the mounting board provides mechanical support, while the resin layer provides stress relief. This segmentation allows each layer to be optimized independently for its specific function without increasing overall structural complexity.
3Ease of manufacture
If electronic components are disposed directly on the mounting board, then assembly is simplified, but stress concentration occurs during thermal cycles
Solution Approach 1:
The resin layer serves as a stress-distributing intermediary between the mounting board and electronic components. It maintains electrical insulation and mechanical attachment while preventing stress concentration during thermal cycling, thus preserving component reliability without complicating the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of characteristic degradation by easing stress on electronic components and effectively dissipating heat, thereby enhancing the reliability and performance of the radio-frequency module.
Implementation Method 1
the insulating layer is disposed over the fourth major surface of the electronic component or disposed over both the fourth major surface of the electronic component and the resin layer
Data Source
AI summary
A radio-frequency module includes a mounting board, an electronic component and an external connection terminal, a resin layer, and an insulating layer. The electronic component and the external connection terminal are disposed at a second major surface of the mounting board. The insulating layer is harder than the resin layer. A third major surface of the electronic components is located between a fourth major surface of the electronic component and the second major surface. The insulating layer is disposed over the fourth major surface of the electronic component or over both the fourth major surface of the electronic component and the resin layer.