RF Module Substrate Isolation via Layered Component Placement

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Solution Overview

Problem

Conventional radio frequency modules with integrated components suffer from reduced isolation characteristics and deteriorated electrical characteristics, such as noise figure and gain, due to the complexity of circuit element arrangements.

Innovation Solution

A radio frequency module design featuring a module substrate with a power amplifier, an inductor connected to the power amplifier, and an external connection terminal for power supply voltage, which helps in reducing noise interference and improving electrical characteristics by optimizing component placement and line lengths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If many electronic components are integrated into a single module to downsize it, then the module size is reduced, but the isolation characteristics between components and lines deteriorate, causing electrical characteristics such as noise figure and gain to worsen

Engineering Contradiction:

Improvemodule sizeVSAvoidelectrical characteristics

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The module substrate is divided into multiple layers (first principal surface, second principal surface, and intermediate layers) to spatially separate different functional components. Power amplifiers, low-noise amplifiers, filters, and other electronic components are distributed across different layers, reducing mutual interference while maintaining compact overall size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from two-dimensional planar arrangement to three-dimensional layered configuration. By utilizing vertical stacking of multiple substrate layers, the design achieves better isolation between components without increasing the horizontal footprint, thus maintaining downsizing while improving electrical characteristics.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If components are closely arranged to reduce module size, then integration density increases, but isolation characteristics between components deteriorate, leading to increased noise interference

Engineering Contradiction:

Improveintegration densityVSAvoidnoise interference

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

Different functional blocks are segmented into separate layers: power amplifiers on one layer, low-noise amplifiers and receivers on another, with intermediate layers providing isolation. This vertical segmentation maintains high integration density while reducing noise coupling between sensitive and noisy components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Intermediate layers are introduced between noisy components (power amplifiers) and sensitive components (receivers, low-noise amplifiers). These intermediate layers act as electromagnetic shields and isolation barriers, blocking noise propagation while allowing the module to maintain compact dimensions.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11563451B2Radio frequency module and communication device

Publication Date: 2023.01.24 MURATA MFG CO LTD

AI summary

A radio frequency module including a module substrate including a first principal surface and a second principal surface; a power amplifier; an inductor disposed on the second principal surface and connected to the power amplifier; and an external connection terminal configured to receive a power supply voltage. The first external connection terminal is disposed on the second principal surface and connected to the power amplifier via the inductor.