RF Module Substrate Layout for Compact Multi-Band Transmission
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Solution Overview
Problem
Existing radio frequency modules face challenges in reducing size while maintaining good transmission characteristics, particularly in supporting multi-band capabilities.
Innovation Solution
A radio frequency module design utilizing a first module substrate with a higher relative dielectric constant than a second module substrate, where electronic components and LC components are disposed between and on the substrates, including a low-temperature co-fired ceramic or high-temperature co-fired ceramic substrate and a printed circuit board, to optimize size reduction and transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two module substrates are used to decrease the size of the radio frequency module, then the size is reduced, but transmission characteristics deteriorate
Solution Approach 1:
The patent applies local quality by using different dielectric constant values in different regions of the module substrate. Specifically, a first module substrate with a higher dielectric constant (5.0-20.0) is used in the region where LC components are disposed, while a second module substrate with a lower dielectric constant (3.0-10.0) is used in other regions. This localized differentiation allows compact LC component placement for size reduction while maintaining overall transmission characteristics through the lower dielectric constant regions.
Solution Approach 2:
The patent employs composite materials by combining two types of module substrates with different dielectric properties. The first substrate material (higher dielectric constant) and second substrate material (lower dielectric constant) are used in combination to achieve both size reduction and maintained transmission characteristics. This composite approach allows optimization of different functional regions within the same module.
2Quantity of substance
If LC components are disposed in the first module substrate with higher dielectric constant, then component density increases and size decreases, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the module into two distinct substrate regions with different dielectric constants. The first module substrate region is dedicated to housing LC components with its higher dielectric constant, while the second module substrate region handles other functions with lower dielectric constant. This segmentation allows optimized component placement and simplifies the manufacturing process by separating functional requirements into distinct manufacturing zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a smaller module size while maintaining effective transmission characteristics, enhancing the module's performance and efficiency in multi-band operations.
Implementation Method 1
A relative dielectric constant of the first module substrate is higher than a relative dielectric constant of the second module substrate
Data Source
AI summary
A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface, multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface, and a LC component that is disposed in the module substrate and that is an inductor or a capacitor. A relative dielectric constant of the module substrate is higher than a relative dielectric constant of the module substrate.