RF Module Surface Separation for Isolation
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Solution Overview
Problem
The existing radio frequency front-end circuit configurations in small-sized modules suffer from electric field coupling, magnetic field coupling, or electromagnetic field coupling between switches and radio frequency components, leading to deteriorated isolation characteristics between transmission and reception circuits.
Innovation Solution
A radio frequency module design with a module board having components such as a power amplifier, low noise amplifier, and an inductor, where at least one of the low noise amplifier or the inductor is positioned on one principal surface, and the switch is on the opposite surface, reducing coupling and allowing for improved isolation and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the front-end circuit is configured in a single module to reduce size, then miniaturization is achieved, but electric field coupling, magnetic field coupling, or electromagnetic field coupling occurs between the switch and radio frequency components, deteriorating isolation characteristics
Solution Approach 1:
The patent applies three-dimensional arrangement by placing different circuit components on opposite surfaces of a substrate. Specifically, the switch is disposed on one surface while the low noise amplifier and inductor are disposed on the other surface, creating spatial separation in the vertical dimension. This dimensional approach reduces electromagnetic coupling while maintaining a compact overall module volume, thus resolving the contradiction between miniaturization and isolation characteristics.
2Volume of moving object
If components are arranged closely to reduce module size, then miniaturization is achieved, but field coupling between switch and radio frequency components increases, worsening isolation
Solution Approach 1:
The patent resolves the contradiction by utilizing the vertical dimension through dual-surface mounting. The switch is positioned on one surface of the substrate while the low noise amplifier and inductor are positioned on the opposite surface. This spatial separation in the vertical dimension effectively reduces electric field coupling, magnetic field coupling, and electromagnetic field coupling between these components, thereby improving isolation characteristics while maintaining a compact module size.
Solution Approach 2:
The substrate serves as an intermediary structure that enables spatial separation between components. By disposing the switch on one surface and the low noise amplifier with its inductor on the other surface, the substrate acts as a physical mediator that reduces direct electromagnetic interaction between these components, thus reducing field coupling while maintaining integration.
Data Source
AI summary
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a radio frequency transmission signal that has been input through a transmission input terminal; a low noise amplifier configured to amplify a radio frequency reception signal; a switch disposed on the second principal surface and connected between the transmission input terminal and the power amplifier; and an inductor of a matching circuit connected to an input terminal of the low noise amplifier. In the radio frequency module, at least one of the low noise amplifier or the inductor is disposed on the first principal surface.