RF Module Surface Segmentation for Signal Isolation
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Solution Overview
Problem
The existing radio frequency module designs for mobile communication devices suffer from deterioration in reception sensitivity due to coupling of high-power transmission signals with circuit components on the reception path via magnetic, electric, or electromagnetic fields, leading to signal interference and distortion.
Innovation Solution
The radio frequency module is configured with a module board having distinct principal surfaces for transmission and reception circuits, where switches and amplifiers are strategically positioned to prevent coupling via electromagnetic fields, using a layout that separates transmission and reception paths to minimize signal interference and improve isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the band selection switch is disposed close to the power amplifier on the same principal surface to enable carrier aggregation, then the transmission signal can be transferred efficiently, but the transmission signal couples with reception path circuit components via electromagnetic fields, causing deterioration in reception sensitivity
Solution Approach 1:
The module board is divided into two distinct principal surfaces: the first principal surface for transmitting high-power transmission signals and the second principal surface for processing reception signals. This segmentation physically separates the transmission and reception paths, preventing electromagnetic coupling while maintaining functional efficiency.
Solution Approach 2:
The invention transitions from a two-dimensional layout on a single principal surface to a three-dimensional arrangement utilizing both surfaces of the module board. By placing the band selection switch and power amplifier on the first principal surface and reception path components on the second principal surface, the invention adds a spatial dimension (z-axis separation) to eliminate electromagnetic interference.
2Area of stationary object
If multiple circuit components are integrated on a single principal surface to reduce module size, then the module becomes more compact, but electromagnetic coupling between transmission and reception paths increases
Solution Approach 1:
The module board is segmented into two functional surfaces: the first principal surface dedicated to transmission components (power amplifier, band selection switch) and the second principal surface dedicated to reception components (LNA, reception filters). This segmentation maintains compact integration while eliminating electromagnetic coupling by distributing components across separate surfaces.
Solution Approach 2:
The invention utilizes the z-axis dimension by employing both principal surfaces of the module board. Components are arranged on opposite surfaces rather than being densely packed on a single surface, thereby reducing electromagnetic coupling while maintaining a compact overall module footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces signal interference and harmonics, enhancing reception sensitivity by isolating transmission and reception circuits and preventing spurious waves from entering the reception path, thereby improving the overall performance of the radio frequency module.
Implementation Method 1
the first band selection switch or the second band selection switch for transferring a high-power transmission signal output from the power amplifier is coupled with at least one of circuit components disposed on a reception path via a magnetic field, an electric field, or an electromagnetic field
Data Source
AI summary
A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.