RF Module Surface Separation for Electromagnetic Coupling

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Solution Overview

Problem

In miniaturized radio frequency modules, electromagnetic coupling between circuit components and LC filters can lead to deterioration of reception sensitivity and signal quality due to harmonic interference and spurious waves, particularly when high-output transmission signals are transmitted.

Innovation Solution

The radio frequency module is configured with a module board having distinct principal surfaces, where the diplexer with a chip inductor is placed on one surface and transmission power amplifiers and other circuit components on the other, interposing the board between them to reduce electromagnetic coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If circuit components are disposed close to the LC filter on the same surface to reduce module size, then miniaturization is achieved, but electromagnetic coupling occurs causing harmonic interference and spurious waves to deteriorate reception sensitivity and signal quality

Engineering Contradiction:
Improvemodule sizeVSAvoidelectromagnetic coupling
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies dimensional separation by disposing the LC filter on the first principal surface of the module board and the transmission power amplifier on the second principal surface, using the board thickness as a spatial dimension to reduce electromagnetic coupling while maintaining miniaturization

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If circuit components are arranged optimally on the same surface to reduce module size, then miniaturization is achieved, but isolation between transmission and reception paths deteriorates due to electromagnetic coupling

Engineering Contradiction:
Improvemodule sizeVSAvoidisolation between transmission and reception paths
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent improves isolation between transmission and reception paths by separating components across different surfaces of the module board, using the third dimension (board thickness) to increase spatial separation and reduce electromagnetic interference while maintaining a compact overall size

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Power

If high-output transmission signals are transmitted, then transmission power is increased, but harmonic waves and spurious waves are generated that flow into reception paths causing deterioration of reception sensitivity

Engineering Contradiction:
Improvetransmission powerVSAvoidharmonic waves and spurious waves
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the harmful electromagnetic waves generated by high-power transmission by physically separating the transmission power amplifier from the LC filter and reception path components, preventing harmonic and spurious waves from coupling into sensitive reception circuits

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The module board acts as an intermediary barrier between the transmission power amplifier and the LC filter, providing physical and electromagnetic isolation that prevents harmful waves generated during high-power transmission from affecting the reception path

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively minimizes electromagnetic coupling, thereby reducing deterioration of reception sensitivity and signal quality by preventing harmonic interference and spurious waves from entering reception paths.

Implementation Method 1

electromagnetic coupling may occur between a circuit component disposed on a transmission path and an inductor of an LC filter

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS11323142B2Radio frequency module and communication device
Publication Date: 2022.05.03 MURATA MFG CO LTD
  • US11323142B2 patent drawing
  • US11323142B2 patent drawing
  • US11323142B2 patent drawing

AI summary

A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.