High-Frequency Module Electrode Layout for Terminal Isolation
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Solution Overview
Problem
Existing high-frequency modules experience a decrease in isolation between terminals, which affects their performance in communication devices.
Innovation Solution
A high-frequency module design that includes a mounting substrate, electronic components, a resin layer, and a metal electrode layer, where the metal electrode layer covers the resin layer and overlaps with the electronic components, and has a through-portion between signal terminals to enhance isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal electrode layer is formed on the resin layer to provide shielding and electrical connection, then the electrical connectivity and shielding performance are improved, but the isolation between adjacent signal terminals deteriorates due to electromagnetic coupling through the continuous metal layer
Solution Approach 1:
The continuous metal electrode layer is divided into separate metal electrodes corresponding to different signal terminals. By segmenting the metal layer, electrical connectivity is maintained for each terminal while preventing electromagnetic coupling between adjacent terminals, thus improving isolation without sacrificing connectivity.
Solution Approach 2:
The harmful continuous metal layer is extracted and replaced with discrete metal electrodes positioned only where electrical connection is needed. This removes the source of electromagnetic coupling between terminals while preserving the necessary electrical connectivity functions.
2Productivity
If electronic components are densely mounted on the mounting substrate to increase integration, then the productivity and compactness are improved, but the isolation between adjacent signal terminals deteriorates due to reduced spacing
Solution Approach 1:
The metal electrode layer is segmented into discrete electrodes under each electronic component, creating electrical isolation between adjacent components even when densely packed. This allows high integration density while maintaining terminal isolation through the segmented metal structure.
Solution Approach 2:
Metal electrodes are placed locally only where electrical connection is required beneath each electronic component, rather than forming a continuous layer. This localized metal placement maintains isolation between adjacent signal terminals while enabling dense component mounting.
3Object-affected harmful factors
If a continuous metal electrode layer is used to provide comprehensive shielding, then the shielding performance is improved, but the isolation between signal terminals deteriorates due to electromagnetic coupling through the metal layer
Solution Approach 1:
The continuous shielding metal layer is segmented into discrete metal electrodes positioned only beneath electronic components. This segmentation maintains shielding effectiveness for each component while eliminating the electromagnetic coupling pathway that would exist through a continuous metal layer between adjacent terminals.
Solution Approach 2:
The excessive continuous metal layer is extracted and replaced with minimal discrete metal electrodes. This removes the harmful electromagnetic coupling between terminals while retaining the necessary shielding function for each individual component.
Data Source
AI summary
A high-frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal electrode layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal electrode layer covers at least a part of the resin layer, and overlaps with at least a part of the first electronic component and at least a part of the second electronic component in a plan view. At least a part of a main surface of the first electronic component opposite to the mounting substrate side is in contact with the metal electrode layer. The metal electrode layer has a through-portion between a first signal terminal of the first electronic component and a second signal terminal of the second electronic component in the plan view.