RF Module Terminal Layout for Low-Loss Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In radio frequency modules, the reduction in size leads to increased electric resistance and signal loss due to the thinning of columnar electrodes.
Innovation Solution
A radio frequency module design incorporating a mounting substrate with first and second electronic components, connection terminals, and resin layers, where the second connection terminal is located inside the first connection terminal in a plan view, with the resin layers covering the electronic components and terminals to reduce signal loss while maintaining size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the columnar electrode is thinned to reduce the size of the radio frequency module, then the size is reduced, but the electric resistance increases and signal loss increases
Solution Approach 1:
The patent implements a nested structure where the second connection terminal is positioned inside the first connection terminal in plan view, creating a concentric or nested arrangement of conductive paths. This nested configuration allows multiple conductive paths to occupy overlapping spatial footprints, effectively increasing the total conductive cross-sectional area without increasing the module's planar dimensions, thereby reducing resistance while maintaining compact size.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of connection terminals to a three-dimensional stacked configuration. By positioning the second connection terminal inside the first connection terminal in plan view while extending in the thickness direction, the design utilizes the vertical dimension to increase effective conductive area without increasing the module's footprint, thus reducing resistance while maintaining compact size.
2Volume of moving object
If the columnar electrode is thinned to reduce the size of the radio frequency module, then the size is reduced, but the electric resistance increases
Solution Approach 1:
The patent implements a nested structure where the second connection terminal is positioned inside the first connection terminal in plan view, creating a concentric or nested arrangement of conductive paths. This nested configuration allows multiple conductive paths to occupy overlapping spatial footprints, effectively increasing the total conductive cross-sectional area without increasing the module's planar dimensions, thereby reducing resistance while maintaining compact size.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of connection terminals to a three-dimensional stacked configuration. By positioning the second connection terminal inside the first connection terminal in plan view while extending in the thickness direction, the design utilizes the vertical dimension to increase effective conductive area without increasing the module's footprint, thus reducing resistance while maintaining compact size.
Data Source
AI summary
A radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. The first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. The second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.