RF Module IC Layout With Thermal Isolation for Stacked Circuits

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Solution Overview

Problem

The degradation of electric circuits due to heat generated by power amplifiers in radio-frequency modules, which are stacked above power amplifiers, leading to a reduction in the size of the radio-frequency module.

Innovation Solution

An integrated circuit design with a first base made of a high thermal conductivity material, a second base with lower thermal conductivity, and a low thermal conductive member between the electric circuits and power amplifier circuit, allowing heat dissipation and reducing circuit degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electric circuits are stacked above power amplifiers to reduce module size, then the volume of the radio-frequency module is reduced, but the electric circuits are heated by heat generated by the power amplifiers causing degradation of circuit characteristics

Engineering Contradiction:

Improvevolume of radio-frequency moduleVSAvoidcharacteristics of electric circuits

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent divides the module into two separate bases: a first base for the power amplifier circuit and a second base for the electric circuits. This segmentation physically separates the heat-generating component from the heat-sensitive components, allowing the module to maintain compact volume while preventing thermal degradation of circuit characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a thermal insulation layer as an intermediary between the power amplifier circuit and the electric circuits. This mediator blocks heat transfer from the power amplifier to the electric circuits, enabling the circuits to be positioned above the power amplifier without suffering from thermal degradation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If electric circuits are stacked above power amplifiers, then the area of the radio-frequency module is reduced, but the temperature of the electric circuits increases causing degradation

Engineering Contradiction:

Improvearea of radio-frequency moduleVSAvoidtemperature of electric circuits

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The patent divides the module into two separate bases: a first base for the power amplifier circuit and a second base for the electric circuits. This segmentation physically separates the heat-generating component from the heat-sensitive components, allowing the module to maintain compact area while preventing thermal degradation of circuit characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a low thermal conductive member is disposed between the electric circuit and power amplifier circuit, then heat transfer to the electric circuit is suppressed, but the structural complexity of the integrated circuit increases

Engineering Contradiction:

Improvecharacteristics of electric circuitsVSAvoidstructure of integrated circuit

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the thermal insulation layer with the second base structure, integrating the heat-blocking function into the substrate itself. This merging approach reduces the number of separate components and simplifies the overall structure while still achieving effective thermal isolation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The second base serves multiple functions: it provides mechanical support for the electric circuits and simultaneously acts as a thermal insulation layer to block heat from the power amplifier. This multi-functionality reduces the need for additional dedicated thermal management components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a reduction in size of the radio-frequency module while suppressing the degradation of electric circuits due to heat, enhancing the module's performance and reliability.

Implementation Method 1

a low thermal conductive member that has at least a part formed of a low thermal conductive material having a thermal conductivity lower than the second semiconductor material and that is disposed between the electric circuit and the power amplifier circuit

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

A hollow space is formed inside the first base. The hollow space is located between the electric circuit and the power amplifier circuit.

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12463160B2Integrated circuit and radio-frequency module

Publication Date: 2025.11.04 MURATA MFG CO LTD

AI summary

An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit (for example, a control circuit or a switching circuit), a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a low thermal conductive member that has at least a part formed of a low thermal conductive material having a thermal conductivity lower than the second semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the first base overlaps at least a part of the second base in plan view.