High-Frequency Module Thermal Path for Power Amplifier Cooling
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Solution Overview
Problem
The heat dissipation properties of power amplifiers in existing high-frequency modules are insufficient, leading to potential thermal management issues.
Innovation Solution
A high-frequency module design incorporating a mounting substrate with a resin layer covering power amplifiers, a conductive member surrounding the resin layer, and via conductors connected to the conductive member, enhancing heat dissipation through improved thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power amplifiers are mounted on a mounting substrate without additional heat dissipation structures, then the device structure remains simple, but the heat dissipation properties are insufficient
Solution Approach 1:
The conductive member is disposed within the resin layer, creating a nested structure where the heat dissipation structure is integrated inside the encapsulation material. This allows the conductive member to be surrounded by the resin layer while maintaining compact integration, resolving the contradiction between improved heat dissipation and structural simplicity.
Solution Approach 2:
The conductive member acts as an intermediary heat transfer medium between the power amplifier and the via conductors. It receives heat from the power amplifier through thermal conduction and transfers it to the via conductors, which then conduct heat to the external environment, effectively improving heat dissipation without requiring direct contact between power amplifier and heat sinks.
2Temperature
If via conductors are connected to the conductive member, then thermal pathways are improved, but manufacturing precision requirements increase
Solution Approach 1:
The via conductors are configured to extend through the resin layer and make automatic contact with the conductive member through their own structural design. This self-aligning feature reduces the need for high-precision external alignment during manufacturing, as the via conductors' extension direction and position are determined by their structural configuration rather than requiring precise external positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves heat dissipation properties of power amplifiers, ensuring efficient thermal management and performance in high-frequency communication devices.
Implementation Method 1
The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.
Data Source
AI summary
Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.