RF Module Thermal Sensor Layout for Dual Power Amplifiers
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Solution Overview
Problem
The existing radio frequency modules face challenges in accurately measuring temperature and maintaining performance when multiple power amplifiers transmit signals simultaneously, leading to performance degradation due to local temperature increases and uneven heat distribution.
Innovation Solution
A radio frequency module configuration with a temperature sensor disposed close to both power amplifiers, allowing for accurate temperature measurement and performance optimization, where the maximum output power of one power amplifier is greater than the other, and the sensor's distance from each amplifier ensures effective heat measurement and reduced thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple power amplifiers transmit signals simultaneously, then communication functionality is improved, but temperature measurement accuracy deteriorates due to local temperature increase and uneven heat distribution
Solution Approach 1:
The patent applies local quality by placing the temperature sensor at a specific location closer to the first power amplifier than to the second power amplifier. This creates an asymmetric thermal measurement zone that prioritizes monitoring the higher-power amplifier's thermal conditions, enabling localized temperature management that maintains measurement accuracy even during simultaneous multi-amplifier operation.
Solution Approach 2:
The control circuit continuously monitors temperature sensor output and dynamically adjusts the operating states of the power amplifiers based on real-time thermal conditions. This feedback mechanism prevents temperature-induced performance degradation by modulating amplifier operation in response to measured temperature levels, thereby maintaining both communication functionality and measurement accuracy.
2Power
If multiple power amplifiers operate simultaneously, then transmission capability is improved, but power amplifier performance deteriorates due to excessive temperature increase
Solution Approach 1:
The patent implements dynamics by enabling the control circuit to dynamically adjust power amplifier operating states based on real-time temperature measurements. The system transitions between different operational modes (simultaneous operation, sequential operation, power reduction, or shutdown) depending on thermal conditions, thereby maintaining transmission capability while preventing performance degradation through adaptive thermal management.
Solution Approach 2:
The temperature sensor is pre-positioned closer to the first power amplifier to anticipate and monitor thermal conditions before critical temperature rise occurs. This preliminary monitoring arrangement allows the control circuit to take preventive action by adjusting amplifier operation before temperature-induced performance degradation becomes severe, thereby maintaining reliability during high-power transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables accurate temperature measurement and reduces performance degradation of power amplifiers during simultaneous signal transmission by optimizing heat distribution and measurement accuracy.
Implementation Method 1
a temperature sensor disposed on or over the module substrate
Data Source
AI summary
A radio frequency module includes a module substrate; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the first transmission signal; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the second transmission signal; a temperature sensor disposed on or over the module substrate; and a PA control circuit disposed on or over the module substrate and controls amplification operations of the power amplifiers according to a measurement value of the temperature sensor. The maximum output power of the power amplifier is greater than the maximum output power of the power amplifier, and the distance between the temperature sensor and the power amplifier is less than or equal to the distance between the temperature sensor and the power amplifier.