Dual-Sided RF Module Packaging With Through-Mold LGA Connections
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Solution Overview
Problem
Current radio-frequency (RF) module packaging technologies face challenges in providing effective RF shielding and efficient mounting on circuit boards, particularly in dual-sided configurations with redundant ground pins, which can lead to complex manufacturing processes and potential signal interference.
Innovation Solution
A dual-sided RF module design featuring a packaging substrate with a first side encapsulated by an overmold structure and a second side with through-mold connections, including signal pins and ground pins, allowing for redundant ground pin locations to be utilized for component placement, and an overmold structure that exposes these connections for a land grid array configuration, enabling secure mounting on circuit boards while providing RF shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant ground pins are implemented on the second side of the packaging substrate, then RF shielding is improved, but device complexity increases
Solution Approach 1:
The second side of the packaging substrate is designed to serve multiple functions: it provides redundant ground pins for RF shielding while simultaneously serving as a mounting surface for additional components. This multi-functional design allows the same area to contribute to both electromagnetic compatibility and component integration, reducing overall device complexity.
Solution Approach 2:
The invention utilizes the second side of the packaging substrate as an additional dimensional space for component placement. By mounting components on the second side in areas configured for redundant ground pins, the design effectively adds a third dimension to the component layout, allowing better utilization of space and reducing the need for complex interconnections.
2Ease of operation
If through-mold connections are implemented on the second side with exposed connections, then ease of mounting on circuit board is improved, but manufacturing complexity increases
Solution Approach 1:
The through-mold connections are pre-formed and positioned on the second side of the packaging substrate before final component mounting. The overmold structure is designed to expose these connections in advance, allowing for simplified subsequent mounting operations on the circuit board while the manufacturing process handles the complexity of creating these pre-positioned connections.
3Productivity
If components are mounted on the second side in areas configured for redundant ground pins, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The second side of the packaging substrate is designed with specific local areas configured for redundant ground pins, and components are selectively mounted in these designated areas. This localized approach allows for standardized placement patterns in specific regions, improving productivity through efficient component placement while maintaining precise location control where it is most critical for RF performance.
Data Source
AI summary
A packaged radio-frequency device can include a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side and a first overmold structure implemented on the first side, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement a redundant ground pad or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.