RF Module Transformer Layout for High-Power Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radio frequency modules lack sufficient isolation to support higher power classes, such as power class 1, 1.5, and 2, which are required for enhanced output power capabilities.
Innovation Solution
A radio frequency module design incorporating a plurality of transformers, including a first transformer connected to a first power amplifier circuit supporting a first power class and a second transformer connected to a second power amplifier circuit supporting a higher second power class, with the second power class defined by a maximum output power exceeding power class 3.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple transformers are disposed on the same surface of the module substrate, then the module size can be reduced, but the isolation between transformers becomes insufficient
Solution Approach 1:
The patent applies dimensionality change by disposing transformers on opposite surfaces of the module substrate. Specifically, the first transformer is disposed on the first main surface while the second transformer is disposed on the second main surface, utilizing the third dimension (depth/thickness) of the substrate to achieve spatial separation. This resolves the contradiction by maintaining close proximity (reducing area) while achieving sufficient isolation through vertical separation.
2Area of stationary object
If transformers are disposed close to each other to reduce module size, then area is reduced, but coupling between transformers increases
Solution Approach 1:
The patent eliminates harmful coupling by transitioning from planar arrangement to three-dimensional arrangement. By placing transformers on opposite surfaces of the substrate, the design achieves minimal footprint area while the vertical separation through the substrate thickness provides sufficient isolation to prevent electromagnetic coupling between the transformers.
3Reliability
If isolation between transformers is improved by placing them on opposite surfaces, then power class capability is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the module into distinct functional layers on opposite surfaces. The first power amplifier circuit and first transformer are segmented on the first main surface, while the second power amplifier circuit and second transformer are segmented on the second main surface. This layering approach simplifies manufacturing by allowing independent processing and assembly of each surface, reducing overall complexity despite the three-dimensional arrangement.
Data Source
AI summary
A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, a power amplifier circuit that is disposed on the main surface and supports a first power class, a power amplifier circuit that is disposed on the main surface and supports a second power class, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The second power class is defined by a maximum output power higher than a third power class. The first power class is defined by a maximum output power lower than the second power class or the same maximum output power as the second power class.