RF Module Transformer-Capacitor Layout for Lower Transmission Loss
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Solution Overview
Problem
The existing radio frequency modules with differential amplification type amplifiers have a larger size due to the separate positioning of output transformers and capacitors, which increases the transmission loss of signals.
Innovation Solution
A radio frequency module design where the output transformer is placed inside the module substrate and capacitors are positioned on the substrate surface to overlap the transformer in a plan view, reducing the module's size and minimizing magnetic field coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the output transformer and capacitors are disposed at different positions on the module substrate, then the transmission loss of signals is reduced by not disturbing the magnetic field, but the size of the radio frequency module increases
Solution Approach 1:
The patent applies vertical stacking to arrange components on different layers of the module substrate. The output transformer is disposed on a first main surface while capacitors are disposed on a second main surface (the opposite surface), utilizing the third dimension (vertical direction) to reduce planar occupation area. This allows components to overlap when viewed in plan view, significantly reducing module size while maintaining adequate spacing to prevent magnetic field disturbance.
Solution Approach 2:
The patent implements a nested arrangement where capacitors are positioned to overlap the output transformer in plan view, with the capacitor layer vertically stacked above or below the transformer layer. This nested configuration allows one component to be spatially contained within the projection area of another component, maximizing space utilization and reducing overall module footprint while maintaining electrical isolation through the substrate layers.
2Object-affected harmful factors
If the output transformer and capacitors are disposed at different positions, then magnetic field disturbance is minimized, but the device complexity increases due to multi-layer arrangement
Solution Approach 1:
The patent resolves the complexity issue by systematically organizing components across multiple layers with clear spatial relationships. The output transformer is placed on the first main surface and capacitors on the second main surface, creating a regular multi-layer structure that, while adding vertical complexity, simplifies routing and connection design compared to attempting three-dimensional interconnections. This layered approach provides manufacturing advantages and easier heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact radio frequency module and communication device by reducing the size and transmission loss, while maintaining efficient signal amplification and noise suppression.
Implementation Method 1
the transmission loss of signals is not increased by disturbing the magnetic field generated by the output transformer
Data Source
AI summary
A radio frequency module includes a module substrate including a first main surface facing a second main surface, and a power amplifier including first and second power amplification devices and an output transformer, which includes a primary coil and a secondary coil, and a capacitor connected to the output transformer. One end of the primary coil is connected to the first amplification device. Another end of the primary coil is connected to the second amplification device. One end of the secondary coil is connected to an output terminal. The output transformer is disposed in or on the module substrate and is disposed closer to one of the first and second main surfaces than the other. The capacitor is disposed in or on the other of the first and second main surfaces and is disposed to overlap the output transformer when the module substrate is viewed in a plan view.