RF Module Via-Conductor Heat Dissipation
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Solution Overview
Problem
In multiband radio frequency front-end circuits, heat generated by electronic components is not effectively dissipated, leading to degradation in the properties of the radio frequency module.
Innovation Solution
The radio frequency module includes a module board with power amplifiers on one surface and external-connection terminals on the opposite surface, connected by via-conductors that provide independent heat dissipation paths, preventing heat transfer between power amplifiers and optimizing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple power amplifiers are mounted on the circuit board for multiband communication, then the communication capability is improved, but heat dissipation becomes insufficient and properties degrade
Solution Approach 1:
The patent divides the heat dissipation function into separate pathways for each power amplifier. Each amplifier has its own dedicated via-conductor connecting to external ground terminals, segmenting the heat dissipation routes to prevent heat accumulation and transfer between components. This segmentation allows each amplifier to dissipate heat independently, maintaining performance in multiband communication applications.
2Temperature
If via-conductors are used to connect power amplifiers to ground terminals, then heat dissipation is improved, but heat transfer between power amplifiers occurs when via-conductors are close
Solution Approach 1:
The patent applies local quality by spacing via-conductors at different distances from each other based on their specific heat dissipation requirements. The first via-conductor is positioned at a first distance from the first power amplifier, while the second via-conductor is positioned at a second distance from the second power amplifier. This non-uniform spacing optimizes heat dissipation for each amplifier while preventing harmful heat transfer between them, as the spaced-apart configuration ensures thermal isolation.
3Volume of moving object
If electronic components are mounted on both surfaces of the circuit board, then space utilization is improved, but heat transfer to opposite surface components occurs
Solution Approach 1:
The patent extracts the heat dissipation pathway from the internal circuit board structure by using via-conductors to connect power amplifiers on the first surface directly to external ground terminals on the second surface. This extraction removes heat from the system through dedicated external pathways, preventing heat transfer to other components mounted on the opposite surface. The via-conductors serve as thermal extraction channels that bypass the circuit board's internal heat transfer paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation properties, maintaining the performance of power amplifiers and reducing heat-related degradation in the radio frequency module, enabling efficient heat dissipation from power amplifiers to the external board.
Implementation Method 1
via-conductors that provide independent heat dissipation paths, preventing heat transfer between power amplifiers and optimizing heat dissipation efficiency
Data Source
AI summary
A radio frequency module includes: a first power amplifier and a second power amplifier on a first principal surface of a module board; external-connection terminals on a second principal surface; and a first via-conductor and a second via-conductor apart from each other inside of the board. One end of the first via-conductor is connected to a ground electrode of the first power amplifier, and the other end is connected to a first external-connection terminal. One end of the second via-conductor is connected to a ground electrode of the second power amplifier, and the other end is connected to a second external-connection terminal. The second via-conductor penetrates the board in a normal direction of the first principal surface, and the first via-conductor includes columnar conductors cascaded with central axes thereof displaced in the normal direction and has no region where the columnar conductors overlap in a plan view of the board.