RF Module Via Conductor Integration
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Solution Overview
Problem
The existing RF module manufacturing process is complex due to the need for separate processes to form conductive posts, which increases the number of manufacturing steps and makes it difficult to reduce the module's size.
Innovation Solution
The RF module design incorporates a module substrate with a recessed region and a protruding region, where via conductors are integrated within the substrate, allowing for electrical connections to an external substrate without external terminals, simplifying the manufacturing process and reducing the module's size by integrating circuit components on both surfaces of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive posts are formed in a separate process from the circuit board, then electrical connection is achieved, but the number of manufacturing processes increases
Solution Approach 1:
The via conductors are integrated into the module substrate during the substrate fabrication process itself, merging the formation of electrical connection paths with the substrate manufacturing. This eliminates the need for separate conductive post formation processes, reducing manufacturing complexity while maintaining reliable electrical connections between circuit components on opposite surfaces of the substrate.
2Reliability
If regions for conductive posts are secured outside the circuit board, then electrical connection is achieved, but the size of the RF module increases
Solution Approach 1:
The via conductors extend vertically through the thickness of the module substrate, utilizing the third dimension (depth) to establish electrical connections between circuit components on opposite surfaces. This vertical integration eliminates the need for external connection terminals that would extend beyond the substrate boundaries, thereby reducing the overall module size while maintaining reliable electrical connectivity.
3Device complexity
If via conductors are integrated within the substrate, then manufacturing process is simplified and size is reduced, but substrate fabrication complexity increases
Solution Approach 1:
The via conductor formation is performed as a preliminary step during the module substrate fabrication process, before the circuit components are mounted. This preliminary integration of via conductors into the substrate structure allows for streamlined manufacturing and reduces the number of subsequent assembly steps, while the precision requirements are managed through standard substrate fabrication techniques.
Data Source
AI summary
A radio-frequency module includes a module substrate. The module substrate includes a first principal surface; a second principal surface on a side of the module substrate that is opposite to the first principal surface; a third principal surface that is recessed toward the first principal surface from the second principal surface in a plan view of the second principal surface; a recessed region in which the third principal surface is a bottom surface; and a protruding region located on an outer periphery of the recessed region, in a plan view of the second principal surface, wherein the protruding region has a via conductor disposed therein, the via conductor extending in a direction perpendicular to the second principal surface and having an end exposed on the second principal surface.