RF Module Via Layout for Isolated Power Amplifier Heat Dissipation
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Solution Overview
Problem
Existing radio frequency modules face challenges in heat dissipation, particularly when supporting multi-band technologies, leading to degradation in performance due to heat transfer between electronic components on a circuit board.
Innovation Solution
The radio frequency module design includes via conductors that connect opposite surfaces of the module board, allowing for independent heat dissipation paths with low thermal resistance, thereby preventing heat exchange between power amplifiers and enhancing overall heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are mounted on both surfaces of the circuit board to support multi-band technologies, then the functionality and signal transfer capability are improved, but heat dissipation becomes insufficient and heat transfer between components increases
Solution Approach 1:
The invention divides the heat dissipation function into separate segments by providing dedicated heat dissipation paths for each power amplifier. The first heat dissipation path is specifically for the first power amplifier and the second heat dissipation path is specifically for the second power amplifier, preventing heat transfer between components while maintaining multi-band functionality.
Solution Approach 2:
The invention introduces intermediate heat dissipation structures (heat dissipation electrodes and heat dissipation paths) between the power amplifiers and the external environment. These intermediary structures provide controlled thermal conduction paths that isolate the power amplifiers from each other while efficiently transferring heat to external heat sinks.
2Temperature
If heat dissipation measures are enhanced for multi-band signal paths, then heat dissipation performance is improved, but the complexity of the circuit board structure increases
Solution Approach 1:
The via conductors serve multiple functions: they provide electrical connection between different layers of the circuit board and simultaneously serve as heat dissipation paths. The ground electrodes on both surfaces of the circuit board serve both as electrical grounding and as heat dissipation electrodes, reducing the need for separate heat dissipation structures.
Solution Approach 2:
The invention merges the electrical connection function and heat dissipation function into a single integrated structure. The via conductors that provide electrical connectivity between layers also provide thermal conduction paths, and the ground electrodes serve both electrical grounding and heat dissipation purposes, thereby reducing structural complexity.
3Temperature
If heat is transferred via the circuit board to dissipate heat from power amplifiers, then heat dissipation is achieved, but heat is also transferred to other electronic components causing performance degradation
Solution Approach 1:
The heat dissipation function is segmented into independent paths for each power amplifier. The first heat dissipation path is exclusively for the first power amplifier and the second heat dissipation path is exclusively for the second power amplifier, preventing heat transfer between components while maintaining effective heat dissipation.
Solution Approach 2:
The invention applies localized heat dissipation structures at specific locations where power amplifiers are mounted. The heat dissipation electrodes are positioned directly beneath each power amplifier, and the via conductors are strategically placed to create localized thermal conduction paths that do not interfere with other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from power amplifiers to the motherboard, reducing thermal resistance and maintaining high amplification performance while supporting multi-band technologies.
Implementation Method 1
the heat generated by the electronic components is transferred via the circuit board to electronic components mounted on a surface on the opposite side
Data Source
AI summary
A radio frequency module includes: a module board including first and second principal surfaces; first and second power amplifiers on the first principal surface; external-connection terminals on the second principal surface; and first and second via conductors connecting the first and second principal surfaces. The first and second via conductors are spaced apart in the module board, one end of the first via conductor is connected to a first ground electrode of the first power amplifier, the other end of the first via conductor is connected to a first external-connection terminal, one end of the second via conductor is connected to a second ground electrode of the second power amplifier, the other end of the second via conductor is connected to a second external-connection terminal, and the first and second via conductors each penetrate through the module board in a direction normal to the first and second principal surfaces.