RF Multiplexer Die Partitioning for Skirt and Reflection Control
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Solution Overview
Problem
Conventional RF multiplexers face design flexibility limitations due to resonators being fabricated on separate chips, making it difficult to optimize them for specific functions such as skirt steepness and counter band frequency reflection.
Innovation Solution
A radio frequency multiplexer circuit where portions of the send and receive circuits are disposed on a single monocrystalline substrate, allowing resonators to be optimized for different functionalities, with different dies handling high power durability and counter band reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resonators are fabricated on separate chips for send and receive filters, then manufacturing simplicity is maintained, but design flexibility and optimization for specific functions deteriorate
Solution Approach 1:
The invention divides the resonator system into two segments: common resonators (coupled to antenna port) fabricated on a first chip and send filter resonators fabricated on a second chip. This segmentation allows each chip to be optimized for its specific function while maintaining manufacturing simplicity through separate fabrication processes.
Solution Approach 2:
The invention combines the common resonators of both send and receive filters on a single first chip, allowing these resonators to be optimized for counter band reflection while sharing the same fabrication process. This merging enables functional optimization without increasing overall manufacturing complexity.
2Ease of manufacture
If all resonators of one filter path are realized on one chip, then manufacturing is simplified, but optimization for specific electrical sub-functions deteriorates
Solution Approach 1:
The invention applies local quality by giving different chips different optimization characteristics: the first chip is optimized for high counter band reflection (local quality for common resonators) while the second chip is optimized for other send filter requirements. Each chip has tailored layer stacks and designs suited to its specific electrical function.
3Reliability
If resonators are optimized for counter band reflection, then power durability is improved, but filter skirt steepness may deteriorate
Solution Approach 1:
The invention segments the resonator functions again, placing resonators optimized for counter band reflection and power handling on the first chip, while send filter resonators requiring steep skirt characteristics are placed on the second chip. This segmentation allows each group to be independently optimized for its primary function without compromise.
Data Source
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AI summary
A radio frequency multiplexer (210, 220, 230) comprises send and receive circuits each including a RF filter circuit (211, 212, 221, 227, 231,..., 234). The send and receive circuits are coupled to an antenna port (225, 245) and corresponding send and receive ports (221, 222). A portion of the send circuit and a portion of the receive circuit are disposed on a single die (213, 226, 250). The layer stacks of the resonators of the send and receive circuits disposed on the single die can be optimized for the required functionality.