RF Multiplexer Resonator Layout for Tx/Rx Filter Optimization

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Solution Overview

Problem

Conventional RF multiplexers face design flexibility limitations due to resonators being fabricated on separate chips, making it difficult to optimize them for specific functions such as skirt steepness and counter band reflection.

Innovation Solution

The RF multiplexer circuit incorporates send and receive circuits with RF filters, where portions of both circuits are disposed on a single monocrystalline substrate, allowing resonators with different functionalities to be manufactured together and optimized independently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If resonators are fabricated on separate chips for Tx and Rx filters, then manufacturing simplicity is maintained, but design flexibility and performance optimization are limited

Engineering Contradiction:
Improvedesign flexibilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the resonator fabrication into two groups: those disposed on the first substrate (Tx filter resonators) and those disposed on the second substrate (Rx filter resonators). This segmentation allows independent optimization of each filter path while maintaining separate manufacturing processes, resolving the contradiction between design flexibility and device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts the resonators from a unified chip structure and separates them onto different substrates according to their functional requirements. This extraction enables each resonator group to be independently designed and optimized for its specific function (Tx or Rx) without being constrained by a common chip architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

2Manufacturing precision

If all resonators are fabricated on one chip, then device complexity is reduced, but optimization for specific functions such as skirt steepness and counter band reflection becomes difficult

Engineering Contradiction:
Improvefilter performance optimizationVSAvoiddevice complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by configuring resonators with different characteristics in different locations: Tx filter resonators on the first substrate are optimized for send path requirements (skirt steepness), while Rx filter resonators on the second substrate are optimized for receive path requirements (counter band reflection). This local optimization resolves the contradiction between manufacturing precision and device complexity.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If resonators are optimized for specific functions with different layer stacks, then filter performance is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvefilter performanceVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent segments the manufacturing process into two independent lines: one for fabricating resonators on the first substrate with layer stacks optimized for Tx filter performance, and another for fabricating resonators on the second substrate with layer stacks optimized for Rx filter performance. This segmentation allows each manufacturing line to be specialized and optimized independently, resolving the contradiction between manufacturing precision and ease of manufacture.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12334912B2Radio frequency multiplexer
Publication Date: 2025.06.17 RF360 EUROPE GMBH
  • US12334912B2 patent drawing
  • US12334912B2 patent drawing
  • US12334912B2 patent drawing

AI summary

A radio frequency multiplexer (210, 220, 230) comprises send and receive circuits each including a RF filter circuit (211, 212, 221, 227, 231, . . . , 234). The send and receive circuits are coupled to an antenna port (225, 245) and corresponding send and receive ports (221, 222). A portion of the send circuit and a portion of the receive circuit are disposed on a single die (213, 226, 250). The layer stacks of the resonators of the send and receive circuits disposed on the single die can be optimized for the required functionality.