RF Multipole PCB Assembly with Self-Aligned Rod Segments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing processes for multipoles in mass spectrometry are inefficient due to the need for precise machining and alignment of multiple rod segments, which increases the number of machining steps and alignment requirements, leading to potential asymmetries in the electric field that can cause ions to be ejected.
Innovation Solution
A radio frequency multipole assembly is created using printed circuit boards with conductive pads and tiles made of conductive metals like stainless steel, titanium, or nickel, where the tiles are affixed to the pads to form RF rods, allowing for self-alignment during reflow soldering, reducing the complexity of alignment and machining steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If segmented rods are used to create multipoles, then the ability to form complex multipole structures is improved, but the number of machining steps and alignment requirements increases
Solution Approach 1:
The patent divides each rod into multiple discrete segments that are mounted on separate PCB substrates. This segmentation allows flexible assembly of complex multipole structures while maintaining manufacturing simplicity through standardized PCB-based fabrication processes for each segment.
Solution Approach 2:
The patent introduces PCB substrates as intermediary platforms to mount the rod segments. These PCBs serve as precision alignment fixtures that eliminate the need for direct mechanical alignment between rod segments, thereby reducing overall assembly complexity while enabling complex multipole configurations.
2Device complexity
If monolithic rods are used, then the number of elements to be machined and aligned is reduced, but the precision of electric field focusing deteriorates
Solution Approach 1:
By dividing rods into segments mounted on PCB substrates, the patent achieves precise positioning of each segment relative to others. The PCB fabrication process provides inherent precision that maintains electric field focusing quality while allowing modular construction that is simpler than machining entire monolithic rods with complex internal features.
Solution Approach 2:
The patent replaces traditional mechanical machining and alignment methods with PCB-based mounting systems. The PCB substrates provide precise mechanical positioning through their fabrication tolerances, eliminating the need for complex mechanical alignment procedures while maintaining the precision required for accurate electric field focusing.
3Ease of manufacture
If traditional machining and alignment methods are used for segmented rods, then the manufacturing process is simplified, but asymmetries in the electric field occur causing ions to be ejected
Solution Approach 1:
The PCB substrates act as intermediary alignment fixtures that ensure precise and consistent positioning of rod segments. This intermediary system maintains electric field symmetry by providing a standardized, precision-fabricated mounting platform that eliminates the asymmetries that would otherwise occur with traditional direct alignment methods.
Solution Approach 2:
The patent changes the manufacturing parameter basis from traditional mechanical machining tolerances to PCB fabrication tolerances. PCB manufacturing provides tighter and more consistent dimensional control, ensuring that rod segments are positioned with high precision relative to each other, thereby maintaining electric field symmetry and preventing ion ejection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing of multipoles by enabling self-alignment of tiles on pads, reducing the number of machining steps and improving the precision of electric field focusing, thereby enhancing ion focusing capabilities in mass spectrometry systems.
Implementation Method 1
the tiles are affixed to the pads to form RF rods, allowing for self-alignment during reflow soldering
Data Source
AI summary
A radio frequency multipole assembly includes first and second printed circuit boards. Each printed circuit board includes a substrate, at least two rows of conductive pads, and a plurality of tiles affixed to the conductive pads to form at least two radio frequency rods of a radio frequency multipole. The first and second printed circuit boards are arranged with the radio frequency rods towards each other and aligned to for the radio frequency multipole.


