RF Package Signal Routing Across 3D Substrate Layers
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Solution Overview
Problem
The integration of multiple RF channels in RF devices, such as high-resolution radar systems, leads to increased package dimensions due to the use of substrate integrated waveguides, which require significant space, and there is a need for cost-effective manufacturing methods while maintaining or reducing the size of these devices.
Innovation Solution
The RF device employs a substrate with RF chips and coupling elements, utilizing RF signal paths that are partially arranged on different levels perpendicular to the substrate's main surface, allowing for three-dimensional signal routing and reducing the device's size by overlapping or crossing signal paths on different levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrate integrated waveguides are used for routing RF channels, then signal robustness and low loss are improved, but package dimensions increase significantly
Solution Approach 1:
The patent transitions from two-dimensional planar routing to three-dimensional routing by utilizing vertical stacking of metal layers and via connections. Multiple RF signal paths are routed through different metal layers (e.g., first metal layer, second metal layer, third metal layer) and connected via via structures, enabling signals to propagate in three dimensions rather than confined to a single plane. This dimensional transition allows compact routing without requiring large substrate areas, thereby reducing package dimensions while maintaining signal integrity through controlled impedance paths.
2Adaptability or versatility
If the number of RF channels is increased, then device functionality is improved, but package dimensions increase
Solution Approach 1:
The patent segments the RF signal routing into multiple independent metal layers, with each layer containing specific RF signal paths. Via connections provide vertical interconnections between layers, allowing signals to be distributed to multiple RF channels through different layer combinations. This segmentation enables multiple RF channels to be routed independently through the substrate without requiring proportional increases in package area, as signals can share vertical space through different horizontal layers.
Solution Approach 2:
By utilizing vertical stacking of metal layers and via connections, the patent enables multiple RF channels to be routed in three dimensions rather than requiring proportional increases in planar area. Different RF channels can share the same substrate area by routing signals through different metal layers at different vertical levels, thereby supporting increased device functionality without significant increases in package dimensions.
3Ease of manufacture
If traditional planar routing is used, then manufacturing is simpler, but signal loss increases over longer distances
Solution Approach 1:
The patent utilizes three-dimensional routing through multiple metal layers and via connections to create more direct signal paths between RF components. By routing signals vertically through via connections and horizontally through different metal layers, the design can achieve shorter effective path lengths compared to constrained planar routing, thereby reducing signal loss over longer distances while maintaining compatibility with standard PCB manufacturing processes.
Data Source
AI summary
A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.