RF Package Module Anti-Pad Spacing for Millimeter Wave 5G

Solution Overview

Problem

RF package modules for ultra-high frequency band communication require short transmission paths and high antenna performance, but existing solutions are costly due to the need for precise manufacturing processes like laser vias or back-drilling, which increase costs and complexity.

Innovation Solution

An RF package module design featuring a multi-layer circuit board with signal vias and ground vias spaced by anti-pads, allowing for efficient signal transfer while reducing manufacturing costs by avoiding costly processes like laser via formation and back-drilling, and optimizing anti-pad radii for improved antenna performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If laser via formation or back-drilling processes are used to space ground vias from antennas, then antenna performance is improved, but manufacturing cost and process complexity increase

Engineering Contradiction:

Improveantenna performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The anti-pad structures are designed and formed during the initial PCB manufacturing process, before assembly and testing. By pre-positioning the anti-pads to create the required spacing between ground vias and antennas, the need for costly post-manufacturing processes like laser via formation or back-drilling is eliminated, while still achieving the desired antenna performance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses anti-pad structures (non-conductive regions) as a temporary or permanent spacing mechanism during manufacturing. These anti-pads serve their purpose of spacing ground vias from antennas during the critical manufacturing phase, avoiding the need for expensive laser processing or back-drilling operations while maintaining signal integrity and antenna performance

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If laser via formation or back-drilling processes are used to space ground vias from antennas, then antenna performance is improved, but device complexity increases

Engineering Contradiction:

Improveantenna performanceVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The anti-pad structures are designed and formed during the initial PCB manufacturing process, before assembly and testing. By pre-positioning the anti-pads to create the required spacing between ground vias and antennas, the need for costly post-manufacturing processes like laser via formation or back-drilling is eliminated, while still achieving the desired antenna performance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses anti-pad structures (non-conductive regions) as a temporary or permanent spacing mechanism during manufacturing. These anti-pads serve their purpose of spacing ground vias from antennas during the critical manufacturing phase, avoiding the need for expensive laser processing or back-drilling operations while maintaining signal integrity and antenna performance

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Loss of energy

If transmission path length is reduced for ultra-high frequency communication, then signal attenuation is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesignal attenuationVSAvoidtransmission path precision

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The patent applies different design approaches to different regions of the PCB. In areas where ground vias are present, anti-pads are used to create local spacing zones that prevent unwanted coupling. This allows the transmission path to maintain optimal length and routing in other areas without being constrained by uniform spacing requirements throughout the entire board, thus reducing overall signal attenuation while maintaining manageable manufacturing precision requirements

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11357099B2RF package module and electronic device comprising RF package module

Publication Date: 2022.06.07 SAMSUNG ELECTRONICS CO LTD

AI summary

The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017.An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided.The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.