Multi-Material Encapsulant and Shield Layout for Thinner RF Packages
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Solution Overview
Problem
The challenge lies in reducing the size and cost of high-frequency communication devices, particularly Bulk Acoustic Wave (BAW) resonators and BAW-based filters, while maintaining performance and integrating them into smaller electronic devices.
Innovation Solution
The solution involves a die last assembly with a solder interconnect and a multiple material encapsulant configuration. This includes milling or grinding a portion of the first dielectric material and the die, applying a second dielectric material over the exposed die portion, and positioning a shield electrically insulated from the die, thereby reducing the thickness of the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional single-material encapsulant configuration is used, then the device structure is simpler, but the device thickness cannot be reduced sufficiently
Solution Approach 1:
The encapsulant is divided into two distinct materials: a first dielectric material forming a body portion, and a second dielectric material forming a top portion. This segmentation allows each material to serve different functions - the first material provides structural support while the second material enables thinner profiling, thereby reducing overall device thickness without compromising structural integrity
Solution Approach 2:
Different regions of the encapsulant are assigned different materials with optimized properties for their specific locations. The first dielectric material is used where structural strength is needed, while the second dielectric material is applied at the top where signal shielding and insulation are critical. This local optimization enables thickness reduction in critical areas while maintaining overall device performance
2Object-affected harmful factors
If shielding is added to reduce signal interference, then signal protection is improved, but device thickness increases
Solution Approach 1:
The shielding function is merged into the encapsulant structure itself by making the second dielectric material electrically insulated from the die. This integration eliminates the need for separate shielding layers, as the encapsulant's top portion provides both structural coverage and electromagnetic shielding, thereby protecting against signal interference without adding extra thickness
Solution Approach 2:
The second dielectric material serves multiple functions simultaneously: it completes the encapsulant structure, provides electrical insulation, and acts as a shield against signal interference. This multi-functionality allows a single component to address multiple requirements, reducing the need for additional elements that would increase device thickness
Data Source
AI summary
The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.