RF Package Groove Shielding for EMI Isolation
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Solution Overview
Problem
In the miniaturization of electronic System In Package (SiP), electromagnetic interference between digital, analog, and radio frequency circuits poses a significant reliability challenge, necessitating an effective shielding solution.
Innovation Solution
A package structure incorporating a substrate with a solid grounded copper layer, radio frequency chip modules, a plastic encapsulation, a groove, a solder filling body, and a shielding layer, where the groove and solder filling body form a metal separating wall to shield electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chips are placed closer together to achieve miniaturization, then the package size is reduced, but electromagnetic interference occurs between adjacent high-frequency chips
Solution Approach 1:
The patent introduces groove structures that divide the package into separate regions, physically segmenting the space between adjacent RF chips. These grooves create isolated chambers that prevent electromagnetic fields from propagating between chips, thereby maintaining miniaturization while reducing interference through spatial segmentation.
Solution Approach 2:
The patent employs intermediary materials including absorbing materials filled in grooves and shielding layers positioned between adjacent RF chips. These intermediary elements act as mediators that absorb or block electromagnetic fields, preventing direct interference between chips while allowing the chips to remain in close proximity for miniaturization.
2Reliability
If shielding structures are added to prevent electromagnetic interference, then reliability is improved, but device complexity increases
Solution Approach 1:
The groove structures serve multiple functions simultaneously: they provide physical separation between chips, contain absorbing materials for electromagnetic shielding, and create structural reinforcement. This multi-functionality reduces the need for additional separate shielding components, thereby improving reliability while controlling complexity.
Solution Approach 2:
The patent implements nested shielding where absorbing materials are placed within grooves that are themselves part of the package substrate structure, and additional shielding layers are positioned within existing package cavities. This nesting approach allows multiple shielding mechanisms to be integrated without proportionally increasing overall structural complexity.
3Object-affected harmful factors
If traditional shielding methods are used, then electromagnetic interference is reduced, but they are not adapted to miniaturization trends
Solution Approach 1:
The patent transitions from traditional planar shielding approaches to three-dimensional groove structures that extend vertically and horizontally through the package. This dimensional approach allows shielding functionality to be integrated within the vertical profile of the package rather than requiring additional lateral space, enabling adaptation to miniaturized form factors.
Data Source
AI summary
The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.