Conformally Shielded RF Package in Package Device
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Solution Overview
Problem
Existing package-in-package (PIP) semiconductor devices face challenges in minimizing electrical interference between internal semiconductor packages and the external environment, while also requiring efficient RF shielding to prevent electromagnetic interference (EMI) and accommodating increased functional capacity with reduced size.
Innovation Solution
A package-in-package semiconductor device is designed with a conformally shielded RF package stacked vertically, incorporating conductive patterns, vias, and an RF shield to provide electrical isolation and RF noise mitigation between the RF package and the semiconductor die, allowing for separate testing of the RF package before integration and flexible stacking configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If RF shielding is implemented using metal cans or embedded shields, then electromagnetic interference protection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements a package-in-package structure where an RF package is nested within a digital package. The RF package substrate is positioned on the digital package substrate, creating a hierarchical nesting arrangement. This nesting approach provides effective EMI shielding by physically separating RF and digital components while maintaining a compact form factor, avoiding the need for additional metal cans or complex embedded shield structures.
Solution Approach 2:
The patent introduces an intermediary barrier layer between the RF package and digital package substrates. This barrier layer, positioned at the interface between the two packages, acts as a mediator to block electromagnetic interference while allowing electrical connections to pass through. The barrier layer provides EMI protection without requiring complex metal shielding structures, simplifying the overall device design.
2Adaptability or versatility
If package-in-package structure is used to increase functional capacity, then device functionality is improved, but electrical interference between internal packages increases
Solution Approach 1:
The patent employs a nested package structure where the RF package is integrated within the digital package. This nesting arrangement allows multiple functional components to coexist in a compact configuration while maintaining physical separation. The structured nesting with defined substrate layers and barrier interfaces minimizes electrical interference between the RF and digital components, enabling high functional capacity without excessive EMI.
Solution Approach 2:
An intermediary barrier layer is introduced between the RF package substrate and digital package substrate to mitigate electrical interference. This barrier layer serves as a mediator that blocks electromagnetic signals while allowing necessary electrical connections to pass through controlled impedance paths. The barrier layer enables the package-in-package structure to achieve high functional capacity without suffering from excessive inter-package EMI.
3Volume of moving object
If vertical stacking is implemented to reduce device size, then device footprint is reduced, but testing difficulty increases
Solution Approach 1:
The patent implements preliminary testing of the RF package before final integration into the package-in-package structure. The RF package is tested independently on the RF package substrate prior to being mounted on the digital package substrate. This preliminary action allows for early detection and correction of defects, simplifying subsequent assembly and reducing overall testing difficulty despite the compact vertical stacking configuration.
4Object-affected harmful factors
If conformal shielding is applied to RF packages, then RF noise mitigation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent integrates conformal shielding within the nested package structure by incorporating shield layers directly into the RF package substrate and digital package substrate. The shielding is conformally applied to the substrate surfaces and integrated during the substrate fabrication process rather than as a separate post-assembly step. This integration approach provides effective RF noise mitigation while simplifying manufacturing by combining shielding with substrate production.
Solution Approach 2:
The barrier layer between the RF and digital packages serves as an intermediary that provides conformal shielding functionality. This barrier layer is applied conformally to the substrate surfaces and integrated into the package structure during manufacturing. The conformal barrier layer provides RF noise mitigation by blocking electromagnetic signals while following the contours of the substrates, achieving effective shielding without requiring complex separate shielding components or post-assembly processes.
Data Source
AI summary
In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including an RF package and a semiconductor die which are provided in a stacked arrangement and are each electrically connected to an underlying substrate through the use of conductive wires alone or in combination with conductive bumps. In certain embodiments of the present invention, the RF package and the semiconductor die are separated from each other by an intervening spacer which is fabricated from aluminum, or from silicon coated with aluminum. If included in the semiconductor device, the spacer is also electrically connected to the substrate, preferably through the use of conductive wires. The RF package, the semiconductor die, the spacer (if included) and a portion of the substrate are at least partially covered or encapsulated by a package body of the semiconductor device.