RF Front-End Package Integration for Compact mmWave Coverage

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Solution Overview

Problem

Radio frequency devices face challenges in size reduction due to the inclusion of multiple antenna arrays, which undesirably increase the device's size and hinder consistent coverage in mmWave communication.

Innovation Solution

A radio frequency package integrating a front-end package with a radio frequency front-end die and power control die connected to an insulation film substrate via connectors, along with multiple transceiver dies and antenna arrays, where each transceiver die is connected to an antenna array using connectors, and the entire system is integrated into a mold with stepped portions for size reduction and improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple antenna arrays are included in the radio frequency device, then consistent coverage in mmWave communication is improved, but the device size increases

Engineering Contradiction:

Improveconsistent coverageVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple antenna arrays and transceiver dies into a single integrated package structure, merging previously separate components into one unified system that maintains consistent mmWave coverage while reducing overall device size

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested configuration where transceiver dies are stacked vertically within the package, and antenna arrays are positioned in different parts of the package, creating a multi-layer integrated structure that maximizes space utilization

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple antenna arrays are included in the radio frequency device, then wireless communication functionality is improved, but the space occupation increases

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidspace occupation

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent transitions from a two-dimensional layout to a three-dimensional integrated package structure, stacking transceiver dies vertically and positioning antenna arrays in different spatial layers, thereby achieving enhanced wireless functionality without proportionally increasing planar space occupation

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If components are integrated into a single package, then device size is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent divides the integrated package into distinct functional modules including front-end packages with radio frequency dies, power control dies, and separately positioned antenna arrays, allowing each segment to be manufactured and tested independently before final integration

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS12555919B2Integration of radio frequency front-end for size reduction and improved performance

Publication Date: 2026.02.17 APPLE INC

AI summary

A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.