Upside-Down RF Package Layout for Simpler PCB Heat Dissipation
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Solution Overview
Problem
Existing electronic packages require complex and costly printed circuit boards for effective heat removal, often necessitating additional heat conducting elements within the board, which complicates manufacturing and increases costs.
Innovation Solution
The electronic package is configured with terminals on the second side of the solidified molding compound, connected via embedded bondwires, and features a heatsink on the printed circuit board for heat dissipation, eliminating the need for internal heat conducting elements and allowing for simpler, less expensive board designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coin or internal heat conducting element is arranged inside the printed circuit board to remove heat, then heat removal effectiveness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the heat dissipation function from the printed circuit board by placing a heatsink directly on the package body's second side. This separates the heat removal task from the PCB, allowing the PCB to be simpler and less costly while the heatsink handles thermal management independently.
Solution Approach 2:
The package body acts as an intermediary structure that provides a mounting surface for the heatsink. By using the package body itself as the heat transfer interface rather than requiring internal PCB heat paths, the solution simplifies the overall thermal management architecture.
2Ease of manufacture
If package terminals are arranged on the printed circuit board, then connection simplicity is improved, but heat management complexity increases
Solution Approach 1:
The patent moves package terminals from the traditional PCB plane to the vertical dimension by arranging them on the package body's second side. This spatial reorganization allows heat sinks to be mounted directly on the package body without interfering with PCB routing, decoupling electrical connection simplicity from thermal management requirements.
3Temperature
If additional heat conducting elements are added to the printed circuit board, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the heat dissipation function from the printed circuit board by placing a heatsink directly on the package body's second side. This separates the heat removal task from the PCB, allowing the PCB to be simpler and less costly while the heatsink handles thermal management independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat transfer away from the package, reducing the complexity and cost of the printed circuit board while maintaining effective heat management, thereby simplifying the manufacturing process and lowering overall costs.
Implementation Method 1
a heatsink that is fixedly connected to the second surface of the printed circuit board... heat is transported in a direction away from the printed circuit board
Implementation Method 2
heat is transported away for instance by using a heatsink on the backside of printed circuit board 710
Implementation Method 3
each package terminal among the plurality of package terminals is arranged on the second side of the body of solidified molding compound and is connected to a respective metal trace using an embedded bondwire that extends through the body of solidified molding compound
Data Source
AI summary
The present invention relates to an electronic package. The present invention particularly applies to radiofrequency, ‘RF’, packages. The present invention further relates to an electronic device comprising such a package. The electronic package according to the invention is configured to be arranged on a printed circuit board of an electronic device in an upside down manner. Instead of the package terminals being arranged on the printed circuit board, the package terminals in the electronic package of the present invention are arranged on the body of solidified molding compound. Connections to the package terminals are obtained using embedded bondwires.