RF Chip Package Thermal Path in Depopulated Solder Bump Regions
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Solution Overview
Problem
High-power RF components generate heat, leading to thermal crosstalk and reduced performance and reliability in semiconductor packages, particularly in 3D stacked dies, where efficient heat dissipation is challenging.
Innovation Solution
Incorporating thermal conductive material in depopulated regions between the chip substrate and the board, such as in areas devoid of solder bumps or ball grid arrays, to enhance heat dissipation and improve solder joint reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power RF components are used to increase frequency and power, then communication performance and data rate are improved, but heat generation increases causing thermal crosstalk and reduced reliability
Solution Approach 1:
The patent applies different material properties to different regions of the package. Thermal conductive material is placed in depopulated regions (areas without solder bumps) to create high thermal conductivity pathways, while populated regions maintain their electrical connection function. This local differentiation allows efficient heat dissipation without compromising electrical performance.
Solution Approach 2:
The patent introduces thermal conductive material as an intermediary substance between the chip substrate and board in depopulated regions. This intermediary material facilitates heat transfer from the chip substrate to the board, acting as a thermal conduit that bridges the thermal gap without interfering with the electrical solder bump connections.
2Temperature
If thermal management is enhanced to dissipate heat from stacked dies, then thermal crosstalk is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the thermal management approach by applying thermal conductive material only in specific depopulated regions rather than uniformly across the entire chip substrate. This segmentation targets heat dissipation to areas where it is most needed while leaving populated regions unchanged, thereby reducing manufacturing complexity compared to a complete thermal interface material application.
Solution Approach 2:
The depopulated regions on the chip substrate serve dual functions: they provide mechanical support and electrical isolation while also serving as pathways for thermal conduction. By utilizing existing empty spaces for thermal management, the patent avoids adding separate thermal management structures, thereby reducing overall device complexity.
3Temperature
If thermal conductive material is added in depopulated regions, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies thermal conductive material to depopulated regions before the final assembly and reflow process. This preliminary action allows the material to be positioned while the structure is more accessible, and subsequent processing steps (such as reflow) automatically complete the bonding without requiring additional precision adjustments, thereby reducing overall manufacturing precision requirements.
Solution Approach 2:
The depopulated regions naturally define the placement areas for thermal conductive material through their geometric boundaries. The material self-aligns to these predefined regions during application, and the subsequent reflow process automatically bonds the material without requiring complex alignment systems, thereby reducing manufacturing precision demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of thermal conductive material effectively dissipates heat from the chip substrate to the board, improving thermal performance and reliability of RF chip packages by reducing thermal crosstalk and enhancing heat management.
Implementation Method 1
a thermal conductive material between the chip substrate and the board in depopulated regions of solder bumps of the chip substrate
Data Source
AI summary
The present disclosure relates to radio frequency (RF) chip packages and, more particularly, to improved thermal performance of RF chip packages and methods of manufacture. The structure includes: a board; a chip substrate; a pattern of solder bumps between the board and the chip substrate; and a thermal conductive material between the chip substrate and the board in depopulated regions of solder bumps of the chip substrate.