RF Package TSV Interconnect for Shorter Signal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic device packages face challenges in reducing size and increasing integration while maintaining efficient signal transmission, leading to increased signal loss due to long transmission paths between RF and power amplifying components.
Innovation Solution
The implementation of an interconnection structure, such as a silicon-through via (TSV), that electrically connects power amplifying and RF components within the device, providing a shorter signal transmission path and reducing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic device packages use conventional packaging solutions to reduce size and achieve higher integration, then integration density is improved, but signal transmission path length increases causing signal loss
Solution Approach 1:
The patent transitions from planar signal transmission to three-dimensional vertical transmission by implementing through-silicon via (TSV) structures. The TSV enables signals to travel vertically through the substrate thickness, creating a direct pathway that bypasses the need for long lateral routing paths, thereby reducing signal loss while maintaining high integration density.
Solution Approach 2:
The patent embeds the TSV interconnection structures within the substrate, nesting the signal transmission path inside the substrate thickness rather than routing it along the surface. This nested configuration allows multiple signal paths to be contained within the substrate volume, reducing external interference and signal loss while maintaining compact packaging.
2Adaptability or versatility
If electronic device packages increase size to support increased electronic functionality, then functionality is improved, but device size increases which is problematic for portable devices
Solution Approach 1:
The patent utilizes the vertical dimension through TSV structures to achieve high functionality within a compact footprint. By stacking electronic components and routing signals vertically through the substrate, the design accommodates increased functionality without proportionally increasing the device's planar area, thus maintaining suitability for portable applications.
Solution Approach 2:
The patent combines multiple functions into integrated structures, where the TSV serves both as an electrical interconnection and as part of the signal transmission pathway. This merging of functions eliminates the need for separate transmission lines and reduces the overall space required for signal routing, enabling high functionality in a compact package.
3Ease of manufacture
If electronic device packages use conventional interconnection methods, then manufacturing is simpler, but signal transmission path length increases causing performance degradation
Solution Approach 1:
The patent segments the substrate into regions with TSV structures strategically positioned to create direct transmission paths between functional blocks. This segmentation allows the signal transmission path to be divided into discrete vertical segments through the substrate, reducing the overall path length and improving signal quality while maintaining manufacturing feasibility through standardized TSV fabrication processes.
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.