Centralized RF Power Delivery for Vacuum Plasma Modules

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Vacuum plasma processing modules require adaptive impedance matching due to varying input impedances over time, which is costly and complex with traditional methods that involve dedicated matchboxes for each module.

Innovation Solution

Implementing a time-invariant impedance transform network within the vacuum plasma processing module and a remote, simpler matchbox for time-variable matching, allowing for centralized RF power delivery to multiple modules with current compensation capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dedicated matchbox is provided for each vacuum plasma processing module to handle high RF currents and perform fast automatic impedance matching, then the impedance matching accuracy and reliability are improved, but the system complexity and cost increase significantly

Engineering Contradiction:
Improveimpedance matching reliabilityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple dedicated matchboxes into a single shared matchbox that serves multiple vacuum plasma processing modules. The shared matchbox performs fast automatic impedance matching for all modules simultaneously, reducing the number of matchboxes from multiple (one per module) to one, thereby simplifying the system while maintaining matching reliability through centralized control and resource sharing.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared matchbox is designed with universal functionality to handle impedance matching for different types of vacuum plasma processing modules (sputtering, etching, PECVD, etc.). It can adapt to various input impedances and operating conditions of different modules through automatic tuning, making a single device perform the function of multiple dedicated matchboxes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If a dedicated matchbox is provided for each vacuum plasma processing module with full impedance matching capability, then the adaptability to different module input impedances is improved, but the cost and device complexity increase

Engineering Contradiction:
Improveimpedance matching adaptabilityVSAvoidmatchbox complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the impedance matching functionality for multiple modules into a single shared matchbox. This unified device maintains adaptability to different module input impedances through automatic tuning mechanisms while reducing overall system complexity by eliminating redundant matchbox components across multiple modules.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared matchbox is designed as a universal impedance matching device that can adapt to various vacuum plasma processing modules with different input impedances. It achieves this through automatic tuning capabilities that allow a single device to perform the function of multiple specialized matchboxes, reducing complexity while maintaining versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Power

If matchboxes are mounted directly to each vacuum plasma processing module to handle high RF currents, then the RF current handling capability is improved, but the system complexity and cost increase

Engineering Contradiction:
ImproveRF current handling capabilityVSAvoidsystem complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent merges the high RF current handling function from multiple distributed matchboxes into a single shared matchbox. This centralized approach maintains the necessary RF current handling capability through proper power distribution architecture while reducing system complexity by consolidating what would otherwise require multiple separate high-power matchbox units.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3711079B1RF power delivery to vacuum plasma processing
Publication Date: 2023.07.05 EVATEC AG
  • EP3711079B1 patent drawingFigure 1
  • EP3711079B1 patent drawingFigure 2
  • EP3711079B1 patent drawingFigure 3~4

AI summary

Rf power is supplied to a vacuum processing module (1o) in that in the plasma processing module (1o) a time invariant impedance transform is performed by an impedance transform network (1T) in the plasma processing module (1o) and a time variable matching is performed by a matchbox connected to the impedance transform network (1T). The impedance transforms network (1T) comprises an inductive element (L) of a hollow conductor. A cooling medium (F1) is flown through the hollow conductor of the impedance transform network as well as through a part of the plasma processing module (1o) to be cooled and not being part of the impedance transform network (1T) at the plasma processing module (1o).