RF Power Module Integrating Amplifier and Switch for Size Reduction

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Solution Overview

Problem

In mobile communication devices, incorporating an antenna switch module between the power amplification module and the antenna increases device size and manufacturing costs, and can lead to signal loss and reduced performance due to the complexity of arranging power amplifier, low pass filter, and antenna switch circuits.

Innovation Solution

A compact electronic device design that integrates a power amplifier circuit and a switch circuit on a wiring board with separate semiconductor chips for power amplification and switching, along with integrated passive elements for low pass filtering, to reduce size and enhance performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an antenna switch module is incorporated between the power amplification module and the antenna, then switching functionality is achieved, but device size increases and manufacturing costs increase

Engineering Contradiction:
Improveswitching functionalityVSAvoiddevice size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent combines the power amplifier circuit and antenna switch circuit into a single integrated module, eliminating the need for a separate antenna switch module. The power amplifier module includes both amplification and switching functions, reducing overall device size while maintaining versatility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power amplifier module is designed to perform multiple functions: power amplification and antenna switching. This multi-functional design eliminates the need for separate dedicated switch modules, reducing device size and manufacturing costs while maintaining adaptability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If an antenna switch module is incorporated between the power amplification module and the antenna, then switching functionality is achieved, but manufacturing costs increase

Engineering Contradiction:
Improveswitching functionalityVSAvoidmanufacturing costs
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines the power amplifier circuit and antenna switch circuit into a single integrated module, reducing the total component count and assembly complexity. This integration lowers manufacturing costs while maintaining switching functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power amplifier module is designed to perform multiple functions: power amplification and antenna switching. This multi-functional design eliminates the need for separate dedicated switch modules, reducing device size and manufacturing costs while maintaining adaptability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If power amplifier, low pass filter, and antenna switch circuits are arranged separately, then circuit functionality is achieved, but signal loss increases and performance decreases

Engineering Contradiction:
Improvecircuit functionalityVSAvoidsignal loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent integrates the power amplifier, low pass filter, and antenna switch circuits into a single compact module with optimized internal connections. This integration minimizes inter-component signal paths and reduces signal loss while maintaining all required circuit functionalities.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7962105B2RF power module
Publication Date: 2011.06.14 MURATA MFG CO LTD
  • US7962105B2 patent drawing
  • US7962105B2 patent drawing
  • US7962105B2 patent drawing

AI summary

A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.