RF Power Module Radiating Element Soldering
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Solution Overview
Problem
Existing RF technology in microwave ovens, primarily using magnetrons, lacks control over frequency and output power, leading to inefficiencies in energy transfer to objects within the cavity.
Innovation Solution
A radiofrequency (RF) power module comprising a printed circuit board (PCB) with a radiating element soldered in parallel to a trace, connected to a waveguide, allowing for efficient RF power transfer to a cavity, with the radiating element's second end differing in length, width, or shape to maximize efficiency and maintain consistent power transfer across different configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a magnetron is used as the electromagnetic wave source, then the device is inexpensive and simple, but the frequency and output power cannot be controlled
Solution Approach 1:
The patent replaces the magnetron (a vacuum tube device with mechanical complexity) with a solid-state RF power module comprising semiconductor devices mounted on a PCB. This substitution enables electronic control of frequency and power output while maintaining cost-effectiveness and simplifying the overall system architecture.
Solution Approach 2:
The invention implements variable control of RF parameters (frequency and power output) through solid-state electronics. The RF power module can dynamically adjust operating parameters to match different cavity impedances and heating requirements, providing adaptability that magnetrons cannot achieve.
2Ease of manufacture
If a magnetron is used as the electromagnetic wave source, then the device is inexpensive and simple, but the output power control is limited
Solution Approach 1:
The patent replaces the magnetron (a vacuum tube device with mechanical complexity) with a solid-state RF power module comprising semiconductor devices mounted on a PCB. This substitution enables electronic control of frequency and power output while maintaining cost-effectiveness and simplifying the overall system architecture.
Solution Approach 2:
The invention implements dynamic control of RF power output through solid-state electronics. The RF power module can rapidly adjust power levels in response to feedback from power sensors and control signals, enabling precise power regulation that is impossible with traditional magnetron-based systems.
3Loss of energy
If the radiating element is soldered in parallel to the trace on the PCB, then the RF power transfer efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent implements a parallel soldering configuration where the radiating element is soldered to multiple points along the PCB trace rather than a single point. This distributes the RF power transfer across multiple connection points, improving overall efficiency while reducing the precision burden on any individual solder joint.
Solution Approach 2:
The invention combines multiple solder connections in parallel to create a robust RF power transfer path. By merging multiple connection points along the trace, the system achieves high power transfer efficiency while tolerating variations in individual solder joint quality, thus reducing overall manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures efficient RF power transfer to the cavity, maintaining efficiency within 1% even when swapping power modules or consumers, and accommodating varying input impedances, thus optimizing energy delivery to objects being processed.
Implementation Method 1
a radiating element having a first end portion and a second end portion. The first end portion of the radiating element is in electrical communication with the trace of the PCB, and the second end portion of the radiating element is in operable communication with a microwave cavity
Implementation Method 2
The radiating element is disposed and soldered in parallel to the trace
Implementation Method 3
the power module further comprises a waveguide wherein the second end of the radiating element is disposed within the waveguide
Implementation Method 4
the power module further comprises a clamping member configured to clamp a waveguide to the PCB so that the radiating element is in contact with the trace
Data Source
AI summary
Disclosed are RF power modules, and RF ovens, each having one or more RF power modules. In particular, a disclosed RF power module may include a printed circuit board (PCB) having a trace; and a radiating element having a first end portion and a second end portion. The first end portion is in electrical communication with the trace of the of PCB, and the second end portion in operable communication with a microwave cavity, and the radiating element is disposed and soldered in parallel to the trace.


