RF Module Power Wiring Segmentation for Amplifier EMI Suppression
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Solution Overview
Problem
In radio frequency modules, the reduced space for power supply wiring within semiconductor integrated circuits leads to electromagnetic interference with amplifiers, making it challenging to secure sufficient space between the wiring and amplifiers.
Innovation Solution
A radio frequency module design that includes a terminal-to-terminal wiring part connecting power supply terminals of amplifiers, with a substrate-side wiring part arranged on the mounting substrate to bypass sensitive areas, reducing electromagnetic interference by ensuring space between the wiring and amplifiers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power supply wiring unit is arranged inside the semiconductor integrated circuit to connect power supply terminals, then the electrical connection between amplifiers is ensured, but the space between the wiring and amplifiers is insufficient causing electromagnetic interference
Solution Approach 1:
The power supply wiring unit is divided into two separate wiring parts: a first wiring part arranged in the semiconductor integrated circuit to connect the power supply electrode to the first amplifier, and a second wiring part arranged on the mounting substrate to connect the first amplifier to the second amplifier. This segmentation allows each wiring part to be optimally positioned, ensuring reliable electrical connection while maintaining sufficient space to prevent electromagnetic interference with the amplifiers.
2Volume of moving object
If the semiconductor integrated circuit size is reduced to decrease module size, then the overall module dimensions are reduced, but the space for power supply wiring inside the circuit is reduced causing electromagnetic interference
Solution Approach 1:
The power supply wiring for the second amplifier is extended from the semiconductor integrated circuit onto the mounting substrate. By utilizing the two-dimensional space of the mounting substrate, the wiring can be arranged with sufficient distance from the amplifiers without increasing the size of the semiconductor integrated circuit itself, thus preventing electromagnetic interference while maintaining compact module dimensions.
3Adaptability or versatility
If more mounting components are added to increase functionality, then the communication apparatus capabilities are enhanced, but the space for power supply wiring is reduced causing electromagnetic interference
Solution Approach 1:
The power supply wiring is segmented into parts located in different spatial regions: within the semiconductor integrated circuit and on the mounting substrate. This allows the mounting components to be arranged on the substrate without conflicting with the power supply wiring paths, enabling enhanced communication functionality while preventing electromagnetic interference through proper spatial separation.
Data Source
AI summary
A radio frequency module capable of suppressing a situation where a power supply wiring unit electromagnetically interferes with an amplifier inside a semiconductor integrated circuit. The radio frequency module includes a mounting substrate, a semiconductor integrated circuit, and a power supply wiring unit. The semiconductor integrated circuit is arranged at the mounting substrate. The semiconductor integrated circuit includes a first amplifier, a second amplifier, and a power supply electrode. The first amplifier includes a first power supply terminal. The second amplifier includes a second power supply terminal. A power supply voltage from the mounting substrate is input to the power supply electrode. The power supply wiring unit connects the power supply electrode to the first power supply terminal and the second power supply terminal.