RF Power Network Thermal Protection Using Temperature Inference
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Solution Overview
Problem
Existing power delivery networks in plasma processing systems face issues with impedance mismatch leading to excess current flow and overheating of components, which can cause damage and failure, and current solutions involving multiple temperature sensors are costly and complex.
Innovation Solution
A method that uses a single point of measurement of RF voltage and current along the power delivery network to calculate temperatures at multiple nodes, eliminating the need for individual temperature sensors and reducing overheating by adjusting duty cycles and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple temperature sensors are installed along the power delivery network to monitor component temperatures, then component protection from overheating is improved, but device complexity and cost increase
Solution Approach 1:
The patent introduces an intermediary measurement system that uses voltage and current sensors to indirectly monitor component temperatures through calculated temperature values. Instead of directly measuring temperature with physical sensors on each component, the system uses electrical parameter measurements (voltage and current) as intermediaries to infer temperature conditions, thereby avoiding the need for multiple direct temperature sensors while maintaining protection capability
Solution Approach 2:
The patent replaces the mechanical/physical temperature sensing system with an electrical measurement and calculation system. Rather than using physical temperature sensors that require direct contact with components, the system substitutes electrical voltage and current measurements combined with mathematical calculations to determine component temperatures, simplifying the physical infrastructure needed
2Reliability
If power is limited to protect components from overheating, then component damage is prevented, but productivity and process performance decrease
Solution Approach 1:
The patent implements dynamic power management where the power delivery network adjusts power levels in real-time based on calculated component temperatures and impedance conditions. Instead of applying static power limits, the system dynamically modulates power delivery to match actual component thermal conditions, allowing maximum power delivery when components are cool and reducing power only when necessary to prevent overheating
Solution Approach 2:
The patent establishes a feedback control loop that continuously monitors voltage and current parameters, calculates component temperatures, and adjusts power delivery accordingly. The system uses the calculated temperature information as feedback to modulate power levels, ensuring components remain within safe thermal limits while maximizing productivity when conditions permit
3Loss of energy
If impedance mismatch occurs in the power delivery network, then power reflection increases causing coupling losses, but component protection mechanisms add complexity
Solution Approach 1:
The patent enables the power delivery network to self-monitor and self-protect by using the existing voltage and current measurement infrastructure to calculate component temperatures and detect impedance mismatch conditions. The system serves its own protection needs without requiring external temperature sensing equipment, using its operational parameters (voltage and current) to identify and respond to problematic conditions including impedance mismatch and overheating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively protects power delivery network components from overheating by reducing operational complexity and costs while maintaining power delivery efficiency.
Implementation Method 1
Reflected power due to large impedance mismatch at the interface may cause excess current flow through one or more components in the power delivery network, causing excess heating of the components
Data Source
AI summary
Described is a method for thermally protecting an electronic circuit. In at least one implementation, electronic circuit comprises at least a first component and a second component. In at least one implementation, method comprises measuring a first input voltage and a first input current of the first component. In at least one implementation, method further comprises computing a second input voltage and a second input current of the second component. In at least one implementation, method further comprises computing a first temperature of the first component and a second temperature of the second component, wherein the first temperature is a function of the first input current and the second temperature is a function of the second input current.


