Integrated RF Receiver Inductor Paths for Low-Cost Tracking Filters
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radio frequency (RF) receivers, particularly television receivers, face challenges in achieving high quality and low cost due to the need for discrete components like inductors and varactors, which are expensive and bulky, while silicon-based integrated circuit solutions do not perform well and require external discrete components, limiting the cost benefits of integrated circuit technology.
Innovation Solution
A radio frequency receiver architecture that combines a tracking bandpass filter with an integrated passive device (IPD) die and a main integrated circuit die into a multi-chip module (MCM), using inductors fabricated on the IPD die to avoid expensive silicon manufacturing and integrate high-quality filtering with low-cost, compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (inductors, varactors, capacitors) are used to build high quality television receivers, then receiver performance is improved, but cost and size increase
Solution Approach 1:
The patent combines multiple discrete components (inductors, varactors, capacitors) into a single integrated circuit chip. The receiver architecture integrates the tuner, mixer, amplifier, and local oscillator onto one chip, eliminating the need for separate discrete components and reducing both cost and size while maintaining performance.
Solution Approach 2:
The integrated circuit chip performs multiple functions simultaneously - it acts as a tuner, mixer, amplifier, and local oscillator generator. This multi-functional integration allows a single component to replace what would traditionally require multiple discrete components, reducing system complexity.
2Ease of manufacture
If silicon-based integrated circuit technology is used to reduce cost, then manufacturing cost decreases, but receiver performance deteriorates
Solution Approach 1:
The patent uses standard silicon-based CMOS fabrication processes with specific parameter optimizations to achieve both low cost and high performance. By carefully selecting and optimizing fabrication parameters (such as metal layer thickness, inductor geometry, and capacitor structures), the integrated receiver achieves performance comparable to discrete components while maintaining the cost advantages of silicon manufacturing.
3Reliability
If external discrete components are added to integrated circuit receivers to improve performance, then receiver performance is improved, but the cost benefits of integrated circuit technology are reduced
Solution Approach 1:
The patent achieves full integration by combining all necessary components (inductors, capacitors, varactors, transistors) onto a single chip. This complete integration eliminates the need for external discrete components, thereby preserving both performance and the cost benefits of integrated circuit technology.
Data Source
AI summary
An integrated receiver includes a first signal processing path, a second signal processing path, and a controller. The first signal processing path has an input and an output for providing a first processed signal, and comprises a first tracking bandpass filter having a first integrated inductor formed with windings in a first number of metal layers of the integrated receiver. The second signal processing path has an input and an output for providing a second processed signal, and comprises a second tracking bandpass filter having a second integrated inductor formed with windings in a second number of metal layers of the integrated receiver. The second number of windings is lower than the first number. The controller enables one of the first and second signal processing paths corresponding to a selected channel of a radio frequency (RF) input signal to provide an output signal.